Analysis of Key Factors Affecting Case-to-Ambient Thermal Resistance in Thermal Modeling of Power Devices
In the application of power converters, the ambient temperature (<i>T<sub>a</sub></i>) experiences significant fluctuations. For the case-to-ambient resistance (<i>R<sub>ca</sub></i>), apart from the influence of the material’s inherent properties, fac...
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2024-11-01
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| Series: | Energies |
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| Online Access: | https://www.mdpi.com/1996-1073/17/22/5692 |
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| author | Kaixin Wei Peiji Shi Pili Bao Chuanchao Liu Yanzhou Qin |
| author_facet | Kaixin Wei Peiji Shi Pili Bao Chuanchao Liu Yanzhou Qin |
| author_sort | Kaixin Wei |
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| description | In the application of power converters, the ambient temperature (<i>T<sub>a</sub></i>) experiences significant fluctuations. For the case-to-ambient resistance (<i>R<sub>ca</sub></i>), apart from the influence of the material’s inherent properties, factors such as heat dissipation structure, working environment, and operational state can all have an impact on the <i>R<sub>ca</sub></i>. Notably, while there are a limited number of models that consider environmental changes, existing models for calculating the <i>R<sub>ca</sub></i> predominantly overlook the influence of varying working conditions or boundary conditions on the self-thermal resistance. Based on simulation and experimental analyses, the methods to calculate the <i>R<sub>ca</sub></i> are outlined, and the key factors, inclusive of the coupling effects that influence the <i>R<sub>ca</sub></i> in the thermal modeling of power devices, are thoroughly discussed. |
| format | Article |
| id | doaj-art-b19a091e014c4f729fd937c9f99bd915 |
| institution | Kabale University |
| issn | 1996-1073 |
| language | English |
| publishDate | 2024-11-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Energies |
| spelling | doaj-art-b19a091e014c4f729fd937c9f99bd9152024-11-26T18:02:21ZengMDPI AGEnergies1996-10732024-11-011722569210.3390/en17225692Analysis of Key Factors Affecting Case-to-Ambient Thermal Resistance in Thermal Modeling of Power DevicesKaixin Wei0Peiji Shi1Pili Bao2Chuanchao Liu3Yanzhou Qin4School of Automobile and Transportation, Tianjin University of Technology and Education, 1310 Dagu South Road, Hexi District, Tianjin 300222, ChinaSchool of Automobile and Transportation, Tianjin University of Technology and Education, 1310 Dagu South Road, Hexi District, Tianjin 300222, ChinaSchool of Automobile and Transportation, Tianjin University of Technology and Education, 1310 Dagu South Road, Hexi District, Tianjin 300222, ChinaCIMC Safeway Technologies Co., Ltd., No. 159 Cheng Gang Road, Nantong 226003, ChinaState Key Laboratory of Engines, Tianjin University, 135 Ya Guan Road, Jinnan District, Tianjin 300350, ChinaIn the application of power converters, the ambient temperature (<i>T<sub>a</sub></i>) experiences significant fluctuations. For the case-to-ambient resistance (<i>R<sub>ca</sub></i>), apart from the influence of the material’s inherent properties, factors such as heat dissipation structure, working environment, and operational state can all have an impact on the <i>R<sub>ca</sub></i>. Notably, while there are a limited number of models that consider environmental changes, existing models for calculating the <i>R<sub>ca</sub></i> predominantly overlook the influence of varying working conditions or boundary conditions on the self-thermal resistance. Based on simulation and experimental analyses, the methods to calculate the <i>R<sub>ca</sub></i> are outlined, and the key factors, inclusive of the coupling effects that influence the <i>R<sub>ca</sub></i> in the thermal modeling of power devices, are thoroughly discussed.https://www.mdpi.com/1996-1073/17/22/5692case-to-ambient thermal resistancepower devicesambient temperaturethermal coupling effectboundary conditions |
| spellingShingle | Kaixin Wei Peiji Shi Pili Bao Chuanchao Liu Yanzhou Qin Analysis of Key Factors Affecting Case-to-Ambient Thermal Resistance in Thermal Modeling of Power Devices Energies case-to-ambient thermal resistance power devices ambient temperature thermal coupling effect boundary conditions |
| title | Analysis of Key Factors Affecting Case-to-Ambient Thermal Resistance in Thermal Modeling of Power Devices |
| title_full | Analysis of Key Factors Affecting Case-to-Ambient Thermal Resistance in Thermal Modeling of Power Devices |
| title_fullStr | Analysis of Key Factors Affecting Case-to-Ambient Thermal Resistance in Thermal Modeling of Power Devices |
| title_full_unstemmed | Analysis of Key Factors Affecting Case-to-Ambient Thermal Resistance in Thermal Modeling of Power Devices |
| title_short | Analysis of Key Factors Affecting Case-to-Ambient Thermal Resistance in Thermal Modeling of Power Devices |
| title_sort | analysis of key factors affecting case to ambient thermal resistance in thermal modeling of power devices |
| topic | case-to-ambient thermal resistance power devices ambient temperature thermal coupling effect boundary conditions |
| url | https://www.mdpi.com/1996-1073/17/22/5692 |
| work_keys_str_mv | AT kaixinwei analysisofkeyfactorsaffectingcasetoambientthermalresistanceinthermalmodelingofpowerdevices AT peijishi analysisofkeyfactorsaffectingcasetoambientthermalresistanceinthermalmodelingofpowerdevices AT pilibao analysisofkeyfactorsaffectingcasetoambientthermalresistanceinthermalmodelingofpowerdevices AT chuanchaoliu analysisofkeyfactorsaffectingcasetoambientthermalresistanceinthermalmodelingofpowerdevices AT yanzhouqin analysisofkeyfactorsaffectingcasetoambientthermalresistanceinthermalmodelingofpowerdevices |