APA (7th ed.) Citation

Wei, K., Shi, P., Bao, P., Liu, C., & Qin, Y. Analysis of Key Factors Affecting Case-to-Ambient Thermal Resistance in Thermal Modeling of Power Devices. MDPI AG.

Chicago Style (17th ed.) Citation

Wei, Kaixin, Peiji Shi, Pili Bao, Chuanchao Liu, and Yanzhou Qin. Analysis of Key Factors Affecting Case-to-Ambient Thermal Resistance in Thermal Modeling of Power Devices. MDPI AG.

MLA (9th ed.) Citation

Wei, Kaixin, et al. Analysis of Key Factors Affecting Case-to-Ambient Thermal Resistance in Thermal Modeling of Power Devices. MDPI AG.