MODELING ANALYSIS AND EXPERIMENTAL RESEARCH OF THE MATERIAL REMOVAL RATE OF THE MONOCRYSTALLINE SILICON IN THE COURSE OF THE ELETRICAL DISCHARGE MACHINING

MODELING ANALYSIS AND EXPERIMENTAL RESEARCH OF THE MATERIAL REMOVAL RATE OF THE MONOCRYSTALLINE SILICON IN THE COURSE OF THE ELETRICAL DISCHARGE MACHINING

Based on the feasibility of the discharge machining of the semiconductor material,it analyze several major factors which influences the material removal rate,including the open circuit voltage,peak current,pulse width and pulse interval.Using central composite design experiments,it inspects the infl...

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Bibliographic Details
Main Authors: XIN Bin, LI ShuJuan, LU Xiong, DONG YongHeng, SHI WeiChao
Format: Article
Language:zho
Published: Editorial Office of Journal of Mechanical Strength 2017-01-01
Series:Jixie qiangdu
Subjects:
EDM
Semiconductor
Material removal rate
Response surface method
Online Access:http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2017.03.011
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