ANALYSIS OF THE INFLUENCE OF SOP LEAD SHAPE ON SOLDER JOINT RELIABILITY
3-D finite element models of SOP（ Small Outline Package） were constructed,in which Anand visco-plasticity constitutive equation was used to describe the mechanic behavior of solder joint. The solder joint deformation and stress distribution with five kinds of lead shapes were researched. The experim...
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| Format: | Article |
| Language: | zho |
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Editorial Office of Journal of Mechanical Strength
2016-01-01
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| Series: | Jixie qiangdu |
| Subjects: | |
| Online Access: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2016.03.030 |
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| _version_ | 1841534896035594240 |
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| author | REN Chao SHAO Jiang ZENG ChenHui XUE HePing |
| author_facet | REN Chao SHAO Jiang ZENG ChenHui XUE HePing |
| author_sort | REN Chao |
| collection | DOAJ |
| description | 3-D finite element models of SOP（ Small Outline Package） were constructed,in which Anand visco-plasticity constitutive equation was used to describe the mechanic behavior of solder joint. The solder joint deformation and stress distribution with five kinds of lead shapes were researched. The experimental program for the identification of numerical simulation was performed with three kinds of lead shapes. Both experimental and simulation results showed that the solder joint life is closely related with lead shape. The lead shape with low stiffness can decrease the stress apparently. With decreasing the bending radius or increasing the standoff height,the component reliability will be enhanced. The numerical simulation result was congruous with experimental testing data,can able to reflect the factual behavior of SOP accurately. |
| format | Article |
| id | doaj-art-ac168d8dbcc347379b1f0c7baa2cb1a0 |
| institution | Kabale University |
| issn | 1001-9669 |
| language | zho |
| publishDate | 2016-01-01 |
| publisher | Editorial Office of Journal of Mechanical Strength |
| record_format | Article |
| series | Jixie qiangdu |
| spelling | doaj-art-ac168d8dbcc347379b1f0c7baa2cb1a02025-01-15T02:36:33ZzhoEditorial Office of Journal of Mechanical StrengthJixie qiangdu1001-96692016-01-013859159530595135ANALYSIS OF THE INFLUENCE OF SOP LEAD SHAPE ON SOLDER JOINT RELIABILITYREN ChaoSHAO JiangZENG ChenHuiXUE HePing3-D finite element models of SOP（ Small Outline Package） were constructed,in which Anand visco-plasticity constitutive equation was used to describe the mechanic behavior of solder joint. The solder joint deformation and stress distribution with five kinds of lead shapes were researched. The experimental program for the identification of numerical simulation was performed with three kinds of lead shapes. Both experimental and simulation results showed that the solder joint life is closely related with lead shape. The lead shape with low stiffness can decrease the stress apparently. With decreasing the bending radius or increasing the standoff height,the component reliability will be enhanced. The numerical simulation result was congruous with experimental testing data,can able to reflect the factual behavior of SOP accurately.http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2016.03.030Lead shapeFinite element methodSmall outline package（SOP）Reliability |
| spellingShingle | REN Chao SHAO Jiang ZENG ChenHui XUE HePing ANALYSIS OF THE INFLUENCE OF SOP LEAD SHAPE ON SOLDER JOINT RELIABILITY Jixie qiangdu Lead shape Finite element method Small outline package（SOP） Reliability |
| title | ANALYSIS OF THE INFLUENCE OF SOP LEAD SHAPE ON SOLDER JOINT RELIABILITY |
| title_full | ANALYSIS OF THE INFLUENCE OF SOP LEAD SHAPE ON SOLDER JOINT RELIABILITY |
| title_fullStr | ANALYSIS OF THE INFLUENCE OF SOP LEAD SHAPE ON SOLDER JOINT RELIABILITY |
| title_full_unstemmed | ANALYSIS OF THE INFLUENCE OF SOP LEAD SHAPE ON SOLDER JOINT RELIABILITY |
| title_short | ANALYSIS OF THE INFLUENCE OF SOP LEAD SHAPE ON SOLDER JOINT RELIABILITY |
| title_sort | analysis of the influence of sop lead shape on solder joint reliability |
| topic | Lead shape Finite element method Small outline package（SOP） Reliability |
| url | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2016.03.030 |
| work_keys_str_mv | AT renchao analysisoftheinfluenceofsopleadshapeonsolderjointreliability AT shaojiang analysisoftheinfluenceofsopleadshapeonsolderjointreliability AT zengchenhui analysisoftheinfluenceofsopleadshapeonsolderjointreliability AT xueheping analysisoftheinfluenceofsopleadshapeonsolderjointreliability |