THERMAL STRESS ANALYSIS OF OPTICAL FIBER IN FLEXIBLE PTOELECTRONIC INTERCONNECTION PRINTED CIRCUIT BOARD BASED ON FINITE ELEMENT METHOD
According to the influence of glass fiber embedded in flexible photoelectric printed circuit board received the thermal stress. The three-dimensional model of flexible photovoltaic substrate was established. Using the finite element thermodynamic analysis method,the comsol software was used to obtai...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Journal of Mechanical Strength
2020-01-01
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| Series: | Jixie qiangdu |
| Subjects: | |
| Online Access: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2020.01.026 |
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