THERMAL STRESS ANALYSIS OF OPTICAL FIBER IN FLEXIBLE PTOELECTRONIC INTERCONNECTION PRINTED CIRCUIT BOARD BASED ON FINITE ELEMENT METHOD
According to the influence of glass fiber embedded in flexible photoelectric printed circuit board received the thermal stress. The three-dimensional model of flexible photovoltaic substrate was established. Using the finite element thermodynamic analysis method,the comsol software was used to obtai...
Saved in:
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Journal of Mechanical Strength
2020-01-01
|
| Series: | Jixie qiangdu |
| Subjects: | |
| Online Access: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2020.01.026 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1841535719881834496 |
|---|---|
| author | WANG WeiYin WU ZhaoHua CHEN GuDi WANG ZhiQi CHEN XiaoYong |
| author_facet | WANG WeiYin WU ZhaoHua CHEN GuDi WANG ZhiQi CHEN XiaoYong |
| author_sort | WANG WeiYin |
| collection | DOAJ |
| description | According to the influence of glass fiber embedded in flexible photoelectric printed circuit board received the thermal stress. The three-dimensional model of flexible photovoltaic substrate was established. Using the finite element thermodynamic analysis method,the comsol software was used to obtain the thermal stress value of the optical fiber in three kinds of groove structures including rectangular,U-shaped and trapezoidal under the SnAgCu lead-free solder reflow soldering process conditions. The results show that the maximum stress occurs at both ends of the optical fiber. When burying a glass fiber without coating layer,the U-shaped groove structure is suitable and the maximum thermal stress is 116. 8 MPa,which is the smallest one in the three kinds of structures. For coated glass fiber,the rectangular groove one is acceptable,and its maximum thermal stress is 100. 99 MPa; In three kinds of groove structures,the maximum position offset in three directions of XYZ is less than 1 μm.The research conclusion has certain reference value and guiding significance for designing the embedded structure of flexible optoelectronic printed circuit boards. |
| format | Article |
| id | doaj-art-ab929bcac5d043f89a4a38c00131204e |
| institution | Kabale University |
| issn | 1001-9669 |
| language | zho |
| publishDate | 2020-01-01 |
| publisher | Editorial Office of Journal of Mechanical Strength |
| record_format | Article |
| series | Jixie qiangdu |
| spelling | doaj-art-ab929bcac5d043f89a4a38c00131204e2025-01-15T02:28:44ZzhoEditorial Office of Journal of Mechanical StrengthJixie qiangdu1001-96692020-01-014216917430607191THERMAL STRESS ANALYSIS OF OPTICAL FIBER IN FLEXIBLE PTOELECTRONIC INTERCONNECTION PRINTED CIRCUIT BOARD BASED ON FINITE ELEMENT METHODWANG WeiYinWU ZhaoHuaCHEN GuDiWANG ZhiQiCHEN XiaoYongAccording to the influence of glass fiber embedded in flexible photoelectric printed circuit board received the thermal stress. The three-dimensional model of flexible photovoltaic substrate was established. Using the finite element thermodynamic analysis method,the comsol software was used to obtain the thermal stress value of the optical fiber in three kinds of groove structures including rectangular,U-shaped and trapezoidal under the SnAgCu lead-free solder reflow soldering process conditions. The results show that the maximum stress occurs at both ends of the optical fiber. When burying a glass fiber without coating layer,the U-shaped groove structure is suitable and the maximum thermal stress is 116. 8 MPa,which is the smallest one in the three kinds of structures. For coated glass fiber,the rectangular groove one is acceptable,and its maximum thermal stress is 100. 99 MPa; In three kinds of groove structures,the maximum position offset in three directions of XYZ is less than 1 μm.The research conclusion has certain reference value and guiding significance for designing the embedded structure of flexible optoelectronic printed circuit boards.http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2020.01.026Flexible photoelectric printed boardReflow solderingOptical fiber embedded structureThermal stress |
| spellingShingle | WANG WeiYin WU ZhaoHua CHEN GuDi WANG ZhiQi CHEN XiaoYong THERMAL STRESS ANALYSIS OF OPTICAL FIBER IN FLEXIBLE PTOELECTRONIC INTERCONNECTION PRINTED CIRCUIT BOARD BASED ON FINITE ELEMENT METHOD Jixie qiangdu Flexible photoelectric printed board Reflow soldering Optical fiber embedded structure Thermal stress |
| title | THERMAL STRESS ANALYSIS OF OPTICAL FIBER IN FLEXIBLE PTOELECTRONIC INTERCONNECTION PRINTED CIRCUIT BOARD BASED ON FINITE ELEMENT METHOD |
| title_full | THERMAL STRESS ANALYSIS OF OPTICAL FIBER IN FLEXIBLE PTOELECTRONIC INTERCONNECTION PRINTED CIRCUIT BOARD BASED ON FINITE ELEMENT METHOD |
| title_fullStr | THERMAL STRESS ANALYSIS OF OPTICAL FIBER IN FLEXIBLE PTOELECTRONIC INTERCONNECTION PRINTED CIRCUIT BOARD BASED ON FINITE ELEMENT METHOD |
| title_full_unstemmed | THERMAL STRESS ANALYSIS OF OPTICAL FIBER IN FLEXIBLE PTOELECTRONIC INTERCONNECTION PRINTED CIRCUIT BOARD BASED ON FINITE ELEMENT METHOD |
| title_short | THERMAL STRESS ANALYSIS OF OPTICAL FIBER IN FLEXIBLE PTOELECTRONIC INTERCONNECTION PRINTED CIRCUIT BOARD BASED ON FINITE ELEMENT METHOD |
| title_sort | thermal stress analysis of optical fiber in flexible ptoelectronic interconnection printed circuit board based on finite element method |
| topic | Flexible photoelectric printed board Reflow soldering Optical fiber embedded structure Thermal stress |
| url | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2020.01.026 |
| work_keys_str_mv | AT wangweiyin thermalstressanalysisofopticalfiberinflexibleptoelectronicinterconnectionprintedcircuitboardbasedonfiniteelementmethod AT wuzhaohua thermalstressanalysisofopticalfiberinflexibleptoelectronicinterconnectionprintedcircuitboardbasedonfiniteelementmethod AT chengudi thermalstressanalysisofopticalfiberinflexibleptoelectronicinterconnectionprintedcircuitboardbasedonfiniteelementmethod AT wangzhiqi thermalstressanalysisofopticalfiberinflexibleptoelectronicinterconnectionprintedcircuitboardbasedonfiniteelementmethod AT chenxiaoyong thermalstressanalysisofopticalfiberinflexibleptoelectronicinterconnectionprintedcircuitboardbasedonfiniteelementmethod |