Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology

Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology

Short-wave infrared (SWIR) imaging has a wide range of applications in civil and military fields. Over the past two decades, significant efforts have been devoted to developing high-resolution, high-sensitivity, and cost-effective SWIR sensors covering the spectral range from 0.9 μm to 3 μm. These a...

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Bibliographic Details
Main Authors: Junhao Du, Xuewei Zhao, Jiale Su, Ben Li, Xiangliang Duan, Tianyu Dong, Hongxiao Lin, Yuhui Ren, Yuanhao Miao, Henry H. Radamson
Format: Article
Language:English
Published: MDPI AG 2025-01-01
Series:Sensors
Subjects:
Ge
InGaAs
SWIR
flip chip
FPAs
Online Access:https://www.mdpi.com/1424-8220/25/1/263
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