Du, J., Zhao, X., Su, J., Li, B., Duan, X., Dong, T., . . . Radamson, H. H. Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology. MDPI AG.
Chicago Style (17th ed.) CitationDu, Junhao, et al. Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology. MDPI AG.
MLA (9th ed.) CitationDu, Junhao, et al. Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology. MDPI AG.
Warning: These citations may not always be 100% accurate.