Study on microstructure control of copper-tin biphase interface in hot-dip tin-plated electronic copper strip
In order to study the effect of reflow process parameters on the copper-tin biphase interface structure of hot dip tinned electronic copper strip, heat treatment of C14415 hot dip tinned electronic copper strip was carried out. Electron backscattering diffraction (EBSD) and transmission electron mic...
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Elsevier
2024-11-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424026358 |
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| author | Yulu Ouyang Yahui Liu Qianqian Zhu Guoshang Zhang Kexing Song Tao Huang Weiwei Lu Dong Liu Aikui Liu Binbin Wang Qi Li |
| author_facet | Yulu Ouyang Yahui Liu Qianqian Zhu Guoshang Zhang Kexing Song Tao Huang Weiwei Lu Dong Liu Aikui Liu Binbin Wang Qi Li |
| author_sort | Yulu Ouyang |
| collection | DOAJ |
| description | In order to study the effect of reflow process parameters on the copper-tin biphase interface structure of hot dip tinned electronic copper strip, heat treatment of C14415 hot dip tinned electronic copper strip was carried out. Electron backscattering diffraction (EBSD) and transmission electron microscopy (TEM) were used to collect and analyze the microcosmic characteristics of the copper-tin biphase interface of hot dip tin-coated electronic copper strip after reflux. The results show that Cu6Sn5 and Cu3Sn are formed at the Cu–Sn biphase interface during reflow welding, and Cu6Sn5 is first formed at the Cu–Sn biphase interface, and Cu3Sn is gradually formed at the bottom of Cu6Sn5 when the Cu–Sn biphase interface forms a high temperature and stable environment. During the growth of Cu and Sn and its series of compounds, different reflow welding processes have no obvious effect on the distribution of interphase orientation difference. The competitive growth process of the multiphase interface during reflow welding was reconstructed through the distribution state of the multiphase interface under different reflow welding processes. The optimal process parameters of reflow welding were 290°C-heat preservation for 3min-air cooling. |
| format | Article |
| id | doaj-art-a91d1cbd9ed54d9db04915d45482085a |
| institution | Kabale University |
| issn | 2238-7854 |
| language | English |
| publishDate | 2024-11-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-a91d1cbd9ed54d9db04915d45482085a2024-12-26T08:55:35ZengElsevierJournal of Materials Research and Technology2238-78542024-11-013371697181Study on microstructure control of copper-tin biphase interface in hot-dip tin-plated electronic copper stripYulu Ouyang0Yahui Liu1Qianqian Zhu2Guoshang Zhang3Kexing Song4Tao Huang5Weiwei Lu6Dong Liu7Aikui Liu8Binbin Wang9Qi Li10School of Material Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, ChinaSchool of Mechatronics Engineering, Henan University of Science and Technology, Luoyang, 471023, China; Corresponding author.School of Material Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, ChinaInstitute of Materials, Henan Academy of Sciences, Zhengzhou, 450002, China; Corresponding author.Institute of Materials, Henan Academy of Sciences, Zhengzhou, 450002, ChinaSchool of Material Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, ChinaSchool of Chemistry and Chemical Engineering, Henan University of Science and Technology, Luoyang, 471003, ChinaKMD Precise Copper Strip (Henan) Co., Ltd., Xinxiang, 453000, ChinaKMD Precise Copper Strip (Henan) Co., Ltd., Xinxiang, 453000, ChinaSchool of Material Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, ChinaSchool of Material Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, ChinaIn order to study the effect of reflow process parameters on the copper-tin biphase interface structure of hot dip tinned electronic copper strip, heat treatment of C14415 hot dip tinned electronic copper strip was carried out. Electron backscattering diffraction (EBSD) and transmission electron microscopy (TEM) were used to collect and analyze the microcosmic characteristics of the copper-tin biphase interface of hot dip tin-coated electronic copper strip after reflux. The results show that Cu6Sn5 and Cu3Sn are formed at the Cu–Sn biphase interface during reflow welding, and Cu6Sn5 is first formed at the Cu–Sn biphase interface, and Cu3Sn is gradually formed at the bottom of Cu6Sn5 when the Cu–Sn biphase interface forms a high temperature and stable environment. During the growth of Cu and Sn and its series of compounds, different reflow welding processes have no obvious effect on the distribution of interphase orientation difference. The competitive growth process of the multiphase interface during reflow welding was reconstructed through the distribution state of the multiphase interface under different reflow welding processes. The optimal process parameters of reflow welding were 290°C-heat preservation for 3min-air cooling.http://www.sciencedirect.com/science/article/pii/S2238785424026358Hot dip tin platingCopper stripReflow weldingCopper-tin biphase interface |
| spellingShingle | Yulu Ouyang Yahui Liu Qianqian Zhu Guoshang Zhang Kexing Song Tao Huang Weiwei Lu Dong Liu Aikui Liu Binbin Wang Qi Li Study on microstructure control of copper-tin biphase interface in hot-dip tin-plated electronic copper strip Journal of Materials Research and Technology Hot dip tin plating Copper strip Reflow welding Copper-tin biphase interface |
| title | Study on microstructure control of copper-tin biphase interface in hot-dip tin-plated electronic copper strip |
| title_full | Study on microstructure control of copper-tin biphase interface in hot-dip tin-plated electronic copper strip |
| title_fullStr | Study on microstructure control of copper-tin biphase interface in hot-dip tin-plated electronic copper strip |
| title_full_unstemmed | Study on microstructure control of copper-tin biphase interface in hot-dip tin-plated electronic copper strip |
| title_short | Study on microstructure control of copper-tin biphase interface in hot-dip tin-plated electronic copper strip |
| title_sort | study on microstructure control of copper tin biphase interface in hot dip tin plated electronic copper strip |
| topic | Hot dip tin plating Copper strip Reflow welding Copper-tin biphase interface |
| url | http://www.sciencedirect.com/science/article/pii/S2238785424026358 |
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