An innovative aluminization process for solid oxide cell interconnects: From the design to the processing and testing
Applying an alumina-based coating at the sealant interface on interconnects can significantly reduce degradation and extend the lifetime of Solid Oxide Cell (SOC) stacks. This study introduces an innovative aluminization process achieved through Electrophoretic Deposition (EPD) of metallic aluminum...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-02-01
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| Series: | Materials & Design |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127525000127 |
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| author | E. Zanchi H. Javed S.De La Pierre M. Ferraris G. Cempura A. Benelli A.R. Boccaccini F. Smeacetto |
| author_facet | E. Zanchi H. Javed S.De La Pierre M. Ferraris G. Cempura A. Benelli A.R. Boccaccini F. Smeacetto |
| author_sort | E. Zanchi |
| collection | DOAJ |
| description | Applying an alumina-based coating at the sealant interface on interconnects can significantly reduce degradation and extend the lifetime of Solid Oxide Cell (SOC) stacks. This study introduces an innovative aluminization process achieved through Electrophoretic Deposition (EPD) of metallic aluminum powder on Crofer22APU stainless steel, reported here for the first time. The EPD suspensions and coating consolidation treatments were optimized for intermediate temperature applications in SOC stack interconnects. The alumina-based coating enhances steel resistance to high-temperature oxidation and improves the interface at the joined areas with the sealant by increasing surface roughness. Alumina-coated interconnect-glass sealant samples were subjected to static air ageing at 850 °C for up to 1000 h to evaluate interface evolution and potential corrosion product formation. The mechanical resistance of the alumina-coated steel joints, both in their initial state and after 1000-hour aging, was assessed via torsion tests, with a shear strength of 31.2 ± 2.0 MPa and 33.0 ± 1.0 MPa for as-prepared and aged samples, respectively, revealing a cohesive fracture mode and no interface degradation even after prolonged aging. |
| format | Article |
| id | doaj-art-a8aa2662608c4073bb5099d2a2383bf1 |
| institution | Kabale University |
| issn | 0264-1275 |
| language | English |
| publishDate | 2025-02-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Materials & Design |
| spelling | doaj-art-a8aa2662608c4073bb5099d2a2383bf12025-01-09T06:12:28ZengElsevierMaterials & Design0264-12752025-02-01250113592An innovative aluminization process for solid oxide cell interconnects: From the design to the processing and testingE. Zanchi0H. Javed1S.De La Pierre2M. Ferraris3G. Cempura4A. Benelli5A.R. Boccaccini6F. Smeacetto7Department of Applied Science and Technology, Politecnico di Torino, Corso Duca degli Abruzzi 24 10129 Torino, ItalySunfire GmbH, Gasanstaltstraße 2 01237 Dresden, GermanyDepartment of Applied Science and Technology, Politecnico di Torino, Corso Duca degli Abruzzi 24 10129 Torino, ItalyDepartment of Applied Science and Technology, Politecnico di Torino, Corso Duca degli Abruzzi 24 10129 Torino, ItalyAGH University of Science and Technology, al. Mickiewicza 30 30-059 Krakow, PolandDepartment of Applied Science and Technology, Politecnico di Torino, Corso Duca degli Abruzzi 24 10129 Torino, Italy; J-Tech@PoliTO, Turin 10129 ItalyDepartment of Materials Science and Engineering, University of Erlangen-Nuremberg, Cauerstr. 6 91058 Erlangen, GermanyDepartment of Applied Science and Technology, Politecnico di Torino, Corso Duca degli Abruzzi 24 10129 Torino, Italy; Corresponding author.Applying an alumina-based coating at the sealant interface on interconnects can significantly reduce degradation and extend the lifetime of Solid Oxide Cell (SOC) stacks. This study introduces an innovative aluminization process achieved through Electrophoretic Deposition (EPD) of metallic aluminum powder on Crofer22APU stainless steel, reported here for the first time. The EPD suspensions and coating consolidation treatments were optimized for intermediate temperature applications in SOC stack interconnects. The alumina-based coating enhances steel resistance to high-temperature oxidation and improves the interface at the joined areas with the sealant by increasing surface roughness. Alumina-coated interconnect-glass sealant samples were subjected to static air ageing at 850 °C for up to 1000 h to evaluate interface evolution and potential corrosion product formation. The mechanical resistance of the alumina-coated steel joints, both in their initial state and after 1000-hour aging, was assessed via torsion tests, with a shear strength of 31.2 ± 2.0 MPa and 33.0 ± 1.0 MPa for as-prepared and aged samples, respectively, revealing a cohesive fracture mode and no interface degradation even after prolonged aging.http://www.sciencedirect.com/science/article/pii/S0264127525000127Solid oxide cellsElectrophoretic depositionJoining |
| spellingShingle | E. Zanchi H. Javed S.De La Pierre M. Ferraris G. Cempura A. Benelli A.R. Boccaccini F. Smeacetto An innovative aluminization process for solid oxide cell interconnects: From the design to the processing and testing Materials & Design Solid oxide cells Electrophoretic deposition Joining |
| title | An innovative aluminization process for solid oxide cell interconnects: From the design to the processing and testing |
| title_full | An innovative aluminization process for solid oxide cell interconnects: From the design to the processing and testing |
| title_fullStr | An innovative aluminization process for solid oxide cell interconnects: From the design to the processing and testing |
| title_full_unstemmed | An innovative aluminization process for solid oxide cell interconnects: From the design to the processing and testing |
| title_short | An innovative aluminization process for solid oxide cell interconnects: From the design to the processing and testing |
| title_sort | innovative aluminization process for solid oxide cell interconnects from the design to the processing and testing |
| topic | Solid oxide cells Electrophoretic deposition Joining |
| url | http://www.sciencedirect.com/science/article/pii/S0264127525000127 |
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