APA (7th ed.) Citation

Li, M., Huang, S., Chen, Z., Liu, J., Yan, L., & Li, C. Silicon carbide nanowire-reinforced micro-Ag joint based on pinning effect for power electronics packaging. Elsevier.

Chicago Style (17th ed.) Citation

Li, Mulan, Shijun Huang, Zehao Chen, Jingwen Liu, Longlong Yan, and Cai-Fu Li. Silicon Carbide Nanowire-reinforced Micro-Ag Joint Based on Pinning Effect for Power Electronics Packaging. Elsevier.

MLA (9th ed.) Citation

Li, Mulan, et al. Silicon Carbide Nanowire-reinforced Micro-Ag Joint Based on Pinning Effect for Power Electronics Packaging. Elsevier.