Research on Pressure-contact Technology of Power Terminals for the Design of High-integration IGBT Module

It briefly introduced the package principle of pressure-contact IGBT devices. In order to achieve high-integration of IGBT module, the effect of pressure-contact technology on its impendence characteristic, parallel application and thermal performance was studied. A design scheme of press-contact IG...

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Main Authors: YUAN Yong, XIONG Hui, HUANG Nan, CHEN Yanping, XIN Li
Format: Article
Language:zho
Published: Editorial Office of Control and Information Technology 2017-01-01
Series:Kongzhi Yu Xinxi Jishu
Subjects:
Online Access:http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2017.01.008
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author YUAN Yong
XIONG Hui
HUANG Nan
CHEN Yanping
XIN Li
author_facet YUAN Yong
XIONG Hui
HUANG Nan
CHEN Yanping
XIN Li
author_sort YUAN Yong
collection DOAJ
description It briefly introduced the package principle of pressure-contact IGBT devices. In order to achieve high-integration of IGBT module, the effect of pressure-contact technology on its impendence characteristic, parallel application and thermal performance was studied. A design scheme of press-contact IGBT device with elastic main power terminals was proposed and its key technology was described. Simulation and experimental results verified the efficiency of press-contact technology in IGBT module design and engineering application.
format Article
id doaj-art-a63a3c936c154a049f1651e35abd88e0
institution Kabale University
issn 2096-5427
language zho
publishDate 2017-01-01
publisher Editorial Office of Control and Information Technology
record_format Article
series Kongzhi Yu Xinxi Jishu
spelling doaj-art-a63a3c936c154a049f1651e35abd88e02025-08-25T06:50:35ZzhoEditorial Office of Control and Information TechnologyKongzhi Yu Xinxi Jishu2096-54272017-01-0134394482321909Research on Pressure-contact Technology of Power Terminals for the Design of High-integration IGBT ModuleYUAN YongXIONG HuiHUANG NanCHEN YanpingXIN LiIt briefly introduced the package principle of pressure-contact IGBT devices. In order to achieve high-integration of IGBT module, the effect of pressure-contact technology on its impendence characteristic, parallel application and thermal performance was studied. A design scheme of press-contact IGBT device with elastic main power terminals was proposed and its key technology was described. Simulation and experimental results verified the efficiency of press-contact technology in IGBT module design and engineering application.http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2017.01.008IGBT modulepressure-contactimpendence distributionparameter consistencythermal performance
spellingShingle YUAN Yong
XIONG Hui
HUANG Nan
CHEN Yanping
XIN Li
Research on Pressure-contact Technology of Power Terminals for the Design of High-integration IGBT Module
Kongzhi Yu Xinxi Jishu
IGBT module
pressure-contact
impendence distribution
parameter consistency
thermal performance
title Research on Pressure-contact Technology of Power Terminals for the Design of High-integration IGBT Module
title_full Research on Pressure-contact Technology of Power Terminals for the Design of High-integration IGBT Module
title_fullStr Research on Pressure-contact Technology of Power Terminals for the Design of High-integration IGBT Module
title_full_unstemmed Research on Pressure-contact Technology of Power Terminals for the Design of High-integration IGBT Module
title_short Research on Pressure-contact Technology of Power Terminals for the Design of High-integration IGBT Module
title_sort research on pressure contact technology of power terminals for the design of high integration igbt module
topic IGBT module
pressure-contact
impendence distribution
parameter consistency
thermal performance
url http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2017.01.008
work_keys_str_mv AT yuanyong researchonpressurecontacttechnologyofpowerterminalsforthedesignofhighintegrationigbtmodule
AT xionghui researchonpressurecontacttechnologyofpowerterminalsforthedesignofhighintegrationigbtmodule
AT huangnan researchonpressurecontacttechnologyofpowerterminalsforthedesignofhighintegrationigbtmodule
AT chenyanping researchonpressurecontacttechnologyofpowerterminalsforthedesignofhighintegrationigbtmodule
AT xinli researchonpressurecontacttechnologyofpowerterminalsforthedesignofhighintegrationigbtmodule