Comparison of different universal adhesives’ bond strength to laser-assisted bleached enamel
Objective: The aim of this in vitro study was to evaluate the bond strength of several universal adhesives used in different application modes to laser-assisted bleached enamel.Materials and Methods: Freshly extracted 72 sound bovine incisors were used for the study. The teeth were bleached with 38%...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Selcuk University Press
2019-04-01
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| Series: | Selcuk Dental Journal |
| Subjects: | |
| Online Access: | https://dergipark.org.tr/tr/download/article-file/891856 |
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| Summary: | Objective:
The aim
of this in vitro study was to
evaluate the bond strength of several universal adhesives used in different
application modes to laser-assisted bleached enamel.Materials
and Methods: Freshly
extracted 72 sound bovine incisors were used for the study. The teeth were
bleached with 38% of hydrogen peroxide gel that was activated with a diode
laser (Epic). The diode laser
with a 949nm wavelength was used at 7 W in continuous mode for 30 s. After
bleaching procedure, the teeth were kept in artificial saliva for 2 weeks. The bleached teeth were randomly assigned into three groups according to
different universal adhesive systems (n=24); Single Bond Universal-SU,
All-Bond Universal-ABU and Adhese Universal-ADU. All
adhesives were applied in two modes: a- etch&rinse (ER); and b- self etch
(SE). A cylinder-shaped resin composite was placed on treated surfaces and
cured. After storage of specimen in distilled water for 24 h, they were
subjected to shear bond strength test. Data were analyzed using two-way ANOVA
followed by Bonferroni test (α = 0.05) Results: The
highest mean shear bond strength values were obtained in Single
Bond Universal group used in self-etch mode (p<0.05). No difference was
observed between All-Bond Universal and Adhese Universal. In etch&rinse
application mode, Adhese Universal resulted in significantly lower bond
strength values (p<0.05) than Single Bond Universal and All-Bond Universal. For all groups, etch&rinse application mode caused significantly
higher bond strength values.
Conclusion: The
bonding performance of tested universal adhesives was enhanced with the
etch&rinse mode application to diode
laser- assisted bleached enamel. Key Words: Diode
laser, universal adhesives, bleaching |
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| ISSN: | 2148-7529 |