The application of organic materials used in IC advanced packaging:A review
With the development of advanced technologies, the importance of semiconductor packaging has been further highlighted. To meet the increasing complexity and performance requirements of semiconductor devices, many integrated circuit (IC) advanced packaging technologies have been developed, which incl...
Saved in:
Main Author: | Liu Jikang |
---|---|
Format: | Article |
Language: | English |
Published: |
Elsevier
2025-04-01
|
Series: | Memories - Materials, Devices, Circuits and Systems |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2773064625000040 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging
by: Makoto Nagata, et al.
Published: (2024-01-01) -
The impact of temperature on the shear bond strength of conventional multi-step and self-adhesive orthodontic adhesive systems: an in-vitro study
by: Grėtė Kazlauskaitė, et al.
Published: (2025-02-01) -
Experimental characterization and numerical modelling analyses of nano-adhesive-bonded joints
by: Fayssal Hadjez, et al.
Published: (2018-03-01) -
Les adhésifs à photopolymérisation radicalaire employés pour le collage structural du verre en conservation-restauration
by: Sandra Gillioz
Published: (2016-03-01) -
Comparison of Using Self etch Adhesive System in Orthodontic Bracket Bonding Procedures
by: Emire Aybüke Erdur, et al.
Published: (2017-12-01)