Status and Development Trends of Integrated IGBT Power Assembly
It summarized three technical methods that could improve the integration level of integrated IGBT power assembly, which included the novel thermal design, packaging and interconnection and driver & control circuit integration. The current technology classification was analyzed. Furthermore, the...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Control and Information Technology
2015-01-01
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| Series: | Kongzhi Yu Xinxi Jishu |
| Subjects: | |
| Online Access: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2015.03.001 |
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| Summary: | It summarized three technical methods that could improve the integration level of integrated IGBT power assembly,
which included the novel thermal design, packaging and interconnection and driver & control circuit integration. The current technology
classification was analyzed. Furthermore, the development trends of IGBT power assembly were discussed, including high intelligent
design and PEBB module design. |
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| ISSN: | 2096-5427 |