Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue
The Sn-1.0Ag-0.5Cu-xBi solder joints with different Bi content were prepared by reflow soldering. The shear strength, intermetallic compound layer, and fatigue evolution in solder joints were then investigated under thermal aging and thermal fatigue. During isothermal aging, the size of Sn grain and...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-01-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424029193 |
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