Layout and Thermal Analysis of Power Devices Using a PC/XC
Thermal analysis during the design process is an essential step towards the achievement of high reliability in modern high density hybrid and integrated circuits. Thermal analysis is also essential for modern, high density PCBs. Traditionally, a solution of the thermal problem is obtained by either...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
1990-01-01
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| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/1990/39587 |
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| Summary: | Thermal analysis during the design process is an essential step towards the achievement of high reliability
in modern high density hybrid and integrated circuits. Thermal analysis is also essential for modern,
high density PCBs. Traditionally, a solution of the thermal problem is obtained by either the method
of finite differences or the method of finite elements. Both methods, however, require a fine 3-D
partition of the substrate, leading to large systems of linear equations the solution of which demands
substantial computing power provided by number crunching machines and/or powerful computer work-stations. |
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| ISSN: | 0882-7516 1563-5031 |