Wetting and brazing of (HfTaZrNbTi)B2 and (HfTaZrNbTi)C High-Entropy Ceramics by AgCuTi filler
The wetting behaviour of (HfTaZrNbTi)B₂ high entropy boride (HEB) and (HfTaZrNbTi)C high-entropy carbide (HEC) with molten Cu and AgCuTi alloy was investigated via the sessile drop method under an Ar/H2 atmosphere. Pure Cu exhibited non-reactive wetting with contact angles ∼ 120° on HEB and ∼ 126° o...
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| Main Authors: | , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-06-01
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| Series: | Open Ceramics |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666539525000598 |
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| Summary: | The wetting behaviour of (HfTaZrNbTi)B₂ high entropy boride (HEB) and (HfTaZrNbTi)C high-entropy carbide (HEC) with molten Cu and AgCuTi alloy was investigated via the sessile drop method under an Ar/H2 atmosphere. Pure Cu exhibited non-reactive wetting with contact angles ∼ 120° on HEB and ∼ 126° on HEC. In contrast, AgCuTi alloy showed strong reactive wetting (contact angle ≤ 17°), primarily driven by reactive Ti. The reaction layer was notably thicker for the HEC/AgCuTi system. Due to the better wetting behaviour and high-temperature interactions with the ceramic substrates, AgCuTi alloy was employed as a filler to braze HEB and HEC using pressure-less Field Assisted Sintering Technique (FAST). The resulting joints demonstrated high apparent shear strength of 176 ± 39 MPa for HEC and 116 ± 38 MPa for HEB, exceeding the strength of the base materials in both cases. |
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| ISSN: | 2666-5395 |