Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition
Abstract The effect of carbon fibers (Cf) and Ni nanoparticles addition on the melting point, microstructure, shear strength, indentation hardness and indentation creep of SnBi58/Cu solder joints were explored. Composite solder with various Cf percentages (0, 0.02, 0.04 and 0.06 wt.%) and 0.1 wt.% N...
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Nature Portfolio
2024-12-01
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| Series: | Scientific Reports |
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| Online Access: | https://doi.org/10.1038/s41598-024-83905-3 |
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| author | Xiangxia Kong Zuchen Liu Ruipeng Ma Junjun Zhai Zhen Pan Xuemei Li Fenglian Sun |
| author_facet | Xiangxia Kong Zuchen Liu Ruipeng Ma Junjun Zhai Zhen Pan Xuemei Li Fenglian Sun |
| author_sort | Xiangxia Kong |
| collection | DOAJ |
| description | Abstract The effect of carbon fibers (Cf) and Ni nanoparticles addition on the melting point, microstructure, shear strength, indentation hardness and indentation creep of SnBi58/Cu solder joints were explored. Composite solder with various Cf percentages (0, 0.02, 0.04 and 0.06 wt.%) and 0.1 wt.% Ni nanoparticles were prepared by solder paste stirring method. The results indicated that the adulteration of Cf and Ni nanoparticles refines the microstructure and improves the mechanical properties of Sn58Bi (SnBi58)/Cu solder joints. However, the added materials have a relatively small impact on the melting point of the composite solder. Solder joints containing 0.04wt.% Cf and 0.1 wt.% Ni nanoparticles showed the best performance in all samples. Compared with SnBi58/Cu solder joints, the shear strength and indentation hardness of SnBi58-0.1Ni-0.04Cf/Cu solder joints was increased by 28.35% and 16.84%, respectively. Furthermore, the indentation creep decreased by 19.61%. When the addition of 0.06 wt.% Cf, there were more voids and Cf accumulation in SnBi58-0.1Ni-0.06Cf/Cu solder joints, which resulting in the shear strength and indentation hardness of SnBi58-0.1Ni-0.06Cf/Cu solder joints were reduced. |
| format | Article |
| id | doaj-art-90d2284b9e304d3aaab91d7285ff4419 |
| institution | Kabale University |
| issn | 2045-2322 |
| language | English |
| publishDate | 2024-12-01 |
| publisher | Nature Portfolio |
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| series | Scientific Reports |
| spelling | doaj-art-90d2284b9e304d3aaab91d7285ff44192025-01-05T12:30:23ZengNature PortfolioScientific Reports2045-23222024-12-0114112010.1038/s41598-024-83905-3Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber additionXiangxia Kong0Zuchen Liu1Ruipeng Ma2Junjun Zhai3Zhen Pan4Xuemei Li5Fenglian Sun6Department of Material Engineering, North China Institute of Aerospace EngineeringDepartment of Material Engineering, North China Institute of Aerospace EngineeringDepartment of Material Engineering, North China Institute of Aerospace EngineeringDepartment of Aeronautics and Astronautics, North China Institute of Aerospace EngineeringDepartment of Materials Science and Chemical Engineering, Harbin University of Science and TechnologySchool of Mechanical and Electronic Engineering, Qiqihar UniversityDepartment of Materials Science and Chemical Engineering, Harbin University of Science and TechnologyAbstract The effect of carbon fibers (Cf) and Ni nanoparticles addition on the melting point, microstructure, shear strength, indentation hardness and indentation creep of SnBi58/Cu solder joints were explored. Composite solder with various Cf percentages (0, 0.02, 0.04 and 0.06 wt.%) and 0.1 wt.% Ni nanoparticles were prepared by solder paste stirring method. The results indicated that the adulteration of Cf and Ni nanoparticles refines the microstructure and improves the mechanical properties of Sn58Bi (SnBi58)/Cu solder joints. However, the added materials have a relatively small impact on the melting point of the composite solder. Solder joints containing 0.04wt.% Cf and 0.1 wt.% Ni nanoparticles showed the best performance in all samples. Compared with SnBi58/Cu solder joints, the shear strength and indentation hardness of SnBi58-0.1Ni-0.04Cf/Cu solder joints was increased by 28.35% and 16.84%, respectively. Furthermore, the indentation creep decreased by 19.61%. When the addition of 0.06 wt.% Cf, there were more voids and Cf accumulation in SnBi58-0.1Ni-0.06Cf/Cu solder joints, which resulting in the shear strength and indentation hardness of SnBi58-0.1Ni-0.06Cf/Cu solder joints were reduced.https://doi.org/10.1038/s41598-024-83905-3Composite solder jointCarbon fiber particlesMicrostructureMechanical properties |
| spellingShingle | Xiangxia Kong Zuchen Liu Ruipeng Ma Junjun Zhai Zhen Pan Xuemei Li Fenglian Sun Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition Scientific Reports Composite solder joint Carbon fiber particles Microstructure Mechanical properties |
| title | Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition |
| title_full | Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition |
| title_fullStr | Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition |
| title_full_unstemmed | Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition |
| title_short | Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition |
| title_sort | microstructural and mechanical responses of sn58bi cu composite solder joints with 0 1wt ni and carbon fiber addition |
| topic | Composite solder joint Carbon fiber particles Microstructure Mechanical properties |
| url | https://doi.org/10.1038/s41598-024-83905-3 |
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