Kong, X., Liu, Z., Ma, R., Zhai, J., Pan, Z., Li, X., & Sun, F. Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition. Nature Portfolio.
Chicago Style (17th ed.) CitationKong, Xiangxia, Zuchen Liu, Ruipeng Ma, Junjun Zhai, Zhen Pan, Xuemei Li, and Fenglian Sun. Microstructural and Mechanical Responses of Sn58Bi/Cu Composite Solder Joints with 0.1wt.% Ni and Carbon Fiber Addition. Nature Portfolio.
MLA (9th ed.) CitationKong, Xiangxia, et al. Microstructural and Mechanical Responses of Sn58Bi/Cu Composite Solder Joints with 0.1wt.% Ni and Carbon Fiber Addition. Nature Portfolio.
Warning: These citations may not always be 100% accurate.