LIU Yang, H. J. Effect of Additives on Electrodeposition of Copper in Ch Cl-Gl A Low Eutectic Solvent. Editorial Department of Materials Protection.
Chicago Style (17th ed.) CitationLIU Yang, HAO Jianjun. Effect of Additives on Electrodeposition of Copper in Ch Cl-Gl A Low Eutectic Solvent. Editorial Department of Materials Protection.
MLA (9th ed.) CitationLIU Yang, HAO Jianjun. Effect of Additives on Electrodeposition of Copper in Ch Cl-Gl A Low Eutectic Solvent. Editorial Department of Materials Protection.
Warning: These citations may not always be 100% accurate.