Impact of Particular Stages of the Manufacturing Process on the Reliability of Flexible Printed Circuits
The purpose of the experiment was to indicate which element of the production process of flexible printed circuit boards is optimal in terms of the reliability of final products. According to the Taguchi method, in the experiment, five factors with two levels each were chosen for the subsequent anal...
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MDPI AG
2024-12-01
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| Series: | Sensors |
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| Online Access: | https://www.mdpi.com/1424-8220/25/1/140 |
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| author | Andrzej Kiernich Jerzy Kalenik Wojciech Stęplewski Marek Kościelski Aneta Chołaj |
| author_facet | Andrzej Kiernich Jerzy Kalenik Wojciech Stęplewski Marek Kościelski Aneta Chołaj |
| author_sort | Andrzej Kiernich |
| collection | DOAJ |
| description | The purpose of the experiment was to indicate which element of the production process of flexible printed circuit boards is optimal in terms of the reliability of final products. According to the Taguchi method, in the experiment, five factors with two levels each were chosen for the subsequent analysis. These included the number of conductive layers, the thickness of the laminate layer, the type of the laminate, the diameter of the plated holes, and the current density in the galvanic bath. The reliability of the PCBs in the produced variations was verified using the Interconnect Stress Test environmental test. The qualitatively best variant of the board construction was indicated using the signal-to-noise ratio and the analysis of variance method for each factor. The factors determined to be the most important in terms of reliability were the number of conductive layers and the current density in the galvanic bath. The optimal variant of the board construction was two conductive layers on a polyimide laminate, where the laminate layer was 100 μm thick, the hole diameter was equal to 0.4 mm, and current density was 2 A/dm<sup>2</sup> in the galvanic bath. Therefore, the plated experiment indicated the factors needed to obtain a high-quality product with a low failure rate. |
| format | Article |
| id | doaj-art-8d7937e6f641426a9057b2d279831740 |
| institution | Kabale University |
| issn | 1424-8220 |
| language | English |
| publishDate | 2024-12-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Sensors |
| spelling | doaj-art-8d7937e6f641426a9057b2d2798317402025-01-10T13:21:01ZengMDPI AGSensors1424-82202024-12-0125114010.3390/s25010140Impact of Particular Stages of the Manufacturing Process on the Reliability of Flexible Printed CircuitsAndrzej Kiernich0Jerzy Kalenik1Wojciech Stęplewski2Marek Kościelski3Aneta Chołaj4Łukasiewicz Research Network—Tele and Radio Research Institute, Ratuszowa 11, 03-450 Warsaw, PolandFaculty of Electronics and Information Technology, Warsaw University of Technology, Nowowiejska 15/19, 00-665 Warsaw, PolandŁukasiewicz Research Network—Tele and Radio Research Institute, Ratuszowa 11, 03-450 Warsaw, PolandŁukasiewicz Research Network—Tele and Radio Research Institute, Ratuszowa 11, 03-450 Warsaw, PolandŁukasiewicz Research Network—Tele and Radio Research Institute, Ratuszowa 11, 03-450 Warsaw, PolandThe purpose of the experiment was to indicate which element of the production process of flexible printed circuit boards is optimal in terms of the reliability of final products. According to the Taguchi method, in the experiment, five factors with two levels each were chosen for the subsequent analysis. These included the number of conductive layers, the thickness of the laminate layer, the type of the laminate, the diameter of the plated holes, and the current density in the galvanic bath. The reliability of the PCBs in the produced variations was verified using the Interconnect Stress Test environmental test. The qualitatively best variant of the board construction was indicated using the signal-to-noise ratio and the analysis of variance method for each factor. The factors determined to be the most important in terms of reliability were the number of conductive layers and the current density in the galvanic bath. The optimal variant of the board construction was two conductive layers on a polyimide laminate, where the laminate layer was 100 μm thick, the hole diameter was equal to 0.4 mm, and current density was 2 A/dm<sup>2</sup> in the galvanic bath. Therefore, the plated experiment indicated the factors needed to obtain a high-quality product with a low failure rate.https://www.mdpi.com/1424-8220/25/1/140environmental testsInterconnect Stress Testdesign of experimentTaguchi methodflexible printed circuitproduct reliability |
| spellingShingle | Andrzej Kiernich Jerzy Kalenik Wojciech Stęplewski Marek Kościelski Aneta Chołaj Impact of Particular Stages of the Manufacturing Process on the Reliability of Flexible Printed Circuits Sensors environmental tests Interconnect Stress Test design of experiment Taguchi method flexible printed circuit product reliability |
| title | Impact of Particular Stages of the Manufacturing Process on the Reliability of Flexible Printed Circuits |
| title_full | Impact of Particular Stages of the Manufacturing Process on the Reliability of Flexible Printed Circuits |
| title_fullStr | Impact of Particular Stages of the Manufacturing Process on the Reliability of Flexible Printed Circuits |
| title_full_unstemmed | Impact of Particular Stages of the Manufacturing Process on the Reliability of Flexible Printed Circuits |
| title_short | Impact of Particular Stages of the Manufacturing Process on the Reliability of Flexible Printed Circuits |
| title_sort | impact of particular stages of the manufacturing process on the reliability of flexible printed circuits |
| topic | environmental tests Interconnect Stress Test design of experiment Taguchi method flexible printed circuit product reliability |
| url | https://www.mdpi.com/1424-8220/25/1/140 |
| work_keys_str_mv | AT andrzejkiernich impactofparticularstagesofthemanufacturingprocessonthereliabilityofflexibleprintedcircuits AT jerzykalenik impactofparticularstagesofthemanufacturingprocessonthereliabilityofflexibleprintedcircuits AT wojciechsteplewski impactofparticularstagesofthemanufacturingprocessonthereliabilityofflexibleprintedcircuits AT marekkoscielski impactofparticularstagesofthemanufacturingprocessonthereliabilityofflexibleprintedcircuits AT anetachołaj impactofparticularstagesofthemanufacturingprocessonthereliabilityofflexibleprintedcircuits |