Research on enhancing thermal conductivity of phase change microcapsules with nano-copper
The unique ability of phase change materials (PCMs) to store and release heat makes their integration into building materials promising for reducing energy consumption and enhancing sustainability. In this work, a novel high-thermal-conductivity microencapsulated phase change material was studied, w...
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| Format: | Article |
| Language: | English |
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IOP Publishing
2024-01-01
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| Series: | Materials Research Express |
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| Online Access: | https://doi.org/10.1088/2053-1591/ad970e |
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| author | Xinjie Yang Zeng Liping Xuebing Dai Xiao Chen Mengyao Sheng Huan Su |
| author_facet | Xinjie Yang Zeng Liping Xuebing Dai Xiao Chen Mengyao Sheng Huan Su |
| author_sort | Xinjie Yang |
| collection | DOAJ |
| description | The unique ability of phase change materials (PCMs) to store and release heat makes their integration into building materials promising for reducing energy consumption and enhancing sustainability. In this work, a novel high-thermal-conductivity microencapsulated phase change material was studied, with nano-copper embedded in the microcapsule structure. This modification enhanced thermal conductivity while largely preserving the material’s latent heat storage capacity. Poly(ethyl acrylate) (PEA) is chosen as the capsule shell, whereas a eutectic mixture of decanoic acid (CA) and lauric acid (LA) serves as the core material. The analysis results indicate that as the shell-core mass ratio decreases, the microcapsule size increases, and both thermal conductivity and thermal diffusivity gradually decrease. Moreover, the latent heat capacity of microencapsulated phase change material (MEPCM) increases. When the shell-core mass ratio is 1:1.5, the melting latent heat and solidification latent heat are 81.85 J g ^−1 and 88.68 J g ^−1 , respectively. nano-copper doping enhances the material’s thermal conductivity and thermal diffusivity by 47.5% and 50%, respectively, leading to a 20.3% improvement in heat storage efficiency. After 200 cycles of testing, the material maintains good thermal reliability and chemical stability. Mortar-based composite materials containing microcapsules were prepared. The mortar composite materials containing microcapsules exhibited minimal influence from heating and cooling, with those containing nano-copper microcapsules demonstrating superior thermal response speeds. The method of doping and modifying MEPCM with nano-copper is a promising approach for effectively reducing the impact of temperature fluctuations on the internal comfort of buildings, improving energy utilization efficiency, and providing reliable solutions for temperature-sensitive applications. |
| format | Article |
| id | doaj-art-8995b5d9313b41e58a196c214d7d92bb |
| institution | Kabale University |
| issn | 2053-1591 |
| language | English |
| publishDate | 2024-01-01 |
| publisher | IOP Publishing |
| record_format | Article |
| series | Materials Research Express |
| spelling | doaj-art-8995b5d9313b41e58a196c214d7d92bb2024-12-04T15:37:57ZengIOP PublishingMaterials Research Express2053-15912024-01-01111212510110.1088/2053-1591/ad970eResearch on enhancing thermal conductivity of phase change microcapsules with nano-copperXinjie Yang0https://orcid.org/0009-0009-5947-5020Zeng Liping1Xuebing Dai2Xiao Chen3Mengyao Sheng4Huan Su5Hunan Institute Engineering , School of Arichitectural Engineering, Xiangtan 411104, People’s Republic of ChinaHunan Institute Engineering , School of Arichitectural Engineering, Xiangtan 411104, People’s Republic of China; Hunan Engineering Research Center of Energy Saving and Material Technology of Green and Low Carbon Building, Xiangtan 411104, People’s Republic of ChinaHunan Institute Engineering , School of Arichitectural Engineering, Xiangtan 411104, People’s Republic of ChinaHunan Institute Engineering , School of Arichitectural Engineering, Xiangtan 411104, People’s Republic of China; Hunan Engineering Research Center of Energy Saving and Material Technology of Green and Low Carbon Building, Xiangtan 411104, People’s Republic of ChinaHunan Institute Engineering , School of Arichitectural Engineering, Xiangtan 411104, People’s Republic of ChinaHunan Institute Engineering , School of Arichitectural Engineering, Xiangtan 411104, People’s Republic of China; Hunan Engineering Research Center of Energy Saving and Material Technology of Green and Low Carbon Building, Xiangtan 411104, People’s Republic of ChinaThe unique ability of phase change materials (PCMs) to store and release heat makes their integration into building materials promising for reducing energy consumption and enhancing sustainability. In this work, a novel high-thermal-conductivity microencapsulated phase change material was studied, with nano-copper embedded in the microcapsule structure. This modification enhanced thermal conductivity while largely preserving the material’s latent heat storage capacity. Poly(ethyl acrylate) (PEA) is chosen as the capsule shell, whereas a eutectic mixture of decanoic acid (CA) and lauric acid (LA) serves as the core material. The analysis results indicate that as the shell-core mass ratio decreases, the microcapsule size increases, and both thermal conductivity and thermal diffusivity gradually decrease. Moreover, the latent heat capacity of microencapsulated phase change material (MEPCM) increases. When the shell-core mass ratio is 1:1.5, the melting latent heat and solidification latent heat are 81.85 J g ^−1 and 88.68 J g ^−1 , respectively. nano-copper doping enhances the material’s thermal conductivity and thermal diffusivity by 47.5% and 50%, respectively, leading to a 20.3% improvement in heat storage efficiency. After 200 cycles of testing, the material maintains good thermal reliability and chemical stability. Mortar-based composite materials containing microcapsules were prepared. The mortar composite materials containing microcapsules exhibited minimal influence from heating and cooling, with those containing nano-copper microcapsules demonstrating superior thermal response speeds. The method of doping and modifying MEPCM with nano-copper is a promising approach for effectively reducing the impact of temperature fluctuations on the internal comfort of buildings, improving energy utilization efficiency, and providing reliable solutions for temperature-sensitive applications.https://doi.org/10.1088/2053-1591/ad970epoly(ethyl acrylate)capric acid and lauric acidphase change materialthermal conductivitythermal energy storagemicrocapsule |
| spellingShingle | Xinjie Yang Zeng Liping Xuebing Dai Xiao Chen Mengyao Sheng Huan Su Research on enhancing thermal conductivity of phase change microcapsules with nano-copper Materials Research Express poly(ethyl acrylate) capric acid and lauric acid phase change material thermal conductivity thermal energy storage microcapsule |
| title | Research on enhancing thermal conductivity of phase change microcapsules with nano-copper |
| title_full | Research on enhancing thermal conductivity of phase change microcapsules with nano-copper |
| title_fullStr | Research on enhancing thermal conductivity of phase change microcapsules with nano-copper |
| title_full_unstemmed | Research on enhancing thermal conductivity of phase change microcapsules with nano-copper |
| title_short | Research on enhancing thermal conductivity of phase change microcapsules with nano-copper |
| title_sort | research on enhancing thermal conductivity of phase change microcapsules with nano copper |
| topic | poly(ethyl acrylate) capric acid and lauric acid phase change material thermal conductivity thermal energy storage microcapsule |
| url | https://doi.org/10.1088/2053-1591/ad970e |
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