Microstructure regulation and fabrication of epoxy-based conductive films with excellent electrical and thermal conductivity, adhesion, toughness, and flexibility
The electrically conductive adhesive films (ECAFs) are new materials used for large-format bonding in microelectronics packaging. However, improving its electrical and thermal conductivity, adhesion, and flexibility simultaneously has been a challenge. In this study, silver powder with different par...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-01-01
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| Series: | Polymer Testing |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0142941824003349 |
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