Microstructure regulation and fabrication of epoxy-based conductive films with excellent electrical and thermal conductivity, adhesion, toughness, and flexibility
The electrically conductive adhesive films (ECAFs) are new materials used for large-format bonding in microelectronics packaging. However, improving its electrical and thermal conductivity, adhesion, and flexibility simultaneously has been a challenge. In this study, silver powder with different par...
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Elsevier
2025-01-01
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| Series: | Polymer Testing |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S0142941824003349 |
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| author | Hongming Yang Li Zhang Rong Chen Shaoyun Guo |
| author_facet | Hongming Yang Li Zhang Rong Chen Shaoyun Guo |
| author_sort | Hongming Yang |
| collection | DOAJ |
| description | The electrically conductive adhesive films (ECAFs) are new materials used for large-format bonding in microelectronics packaging. However, improving its electrical and thermal conductivity, adhesion, and flexibility simultaneously has been a challenge. In this study, silver powder with different particle sizes and poly(3,4-ethylenedioxythiophene)/poly(styrene sulfonate) (PEDOT/PSS) were used to create a high-efficient multi-scale conductive bridge structure. This reduced the volume resistivity from 7.30 × 10−4 Ω cm to 3.80 × 10−4 Ω cm, with lower silver powder content. The thermal conductivity improved from 9.074 W/m·K to 9.124 W/m·K, and adhesion performance between the epoxy matrix and the metal increased from 6.85 MPa to 8.08 MPa. Furthermore, the addition of hydroxyl-functionalized polyurethane materials enhanced the toughness without significantly affecting its electrical, thermal, and adhesion properties. This study successfully prepared epoxy-based conductive adhesive films with a combination of electrical conductivity, thermal conductivity, adhesion, and flexibility, while significantly reducing costs due to the reduction in silver powder content. |
| format | Article |
| id | doaj-art-87e6a1a3e86b481c8b8a0464e959458d |
| institution | Kabale University |
| issn | 1873-2348 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Polymer Testing |
| spelling | doaj-art-87e6a1a3e86b481c8b8a0464e959458d2025-01-12T05:24:05ZengElsevierPolymer Testing1873-23482025-01-01142108657Microstructure regulation and fabrication of epoxy-based conductive films with excellent electrical and thermal conductivity, adhesion, toughness, and flexibilityHongming Yang0Li Zhang1Rong Chen2Shaoyun Guo3The State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Sichuan Provincial Engineering Laboratory of Plastic/Rubber Complex Processing Technology, Chengdu, 610065, ChinaThe State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Sichuan Provincial Engineering Laboratory of Plastic/Rubber Complex Processing Technology, Chengdu, 610065, ChinaCorresponding author.; The State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Sichuan Provincial Engineering Laboratory of Plastic/Rubber Complex Processing Technology, Chengdu, 610065, ChinaThe State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Sichuan Provincial Engineering Laboratory of Plastic/Rubber Complex Processing Technology, Chengdu, 610065, ChinaThe electrically conductive adhesive films (ECAFs) are new materials used for large-format bonding in microelectronics packaging. However, improving its electrical and thermal conductivity, adhesion, and flexibility simultaneously has been a challenge. In this study, silver powder with different particle sizes and poly(3,4-ethylenedioxythiophene)/poly(styrene sulfonate) (PEDOT/PSS) were used to create a high-efficient multi-scale conductive bridge structure. This reduced the volume resistivity from 7.30 × 10−4 Ω cm to 3.80 × 10−4 Ω cm, with lower silver powder content. The thermal conductivity improved from 9.074 W/m·K to 9.124 W/m·K, and adhesion performance between the epoxy matrix and the metal increased from 6.85 MPa to 8.08 MPa. Furthermore, the addition of hydroxyl-functionalized polyurethane materials enhanced the toughness without significantly affecting its electrical, thermal, and adhesion properties. This study successfully prepared epoxy-based conductive adhesive films with a combination of electrical conductivity, thermal conductivity, adhesion, and flexibility, while significantly reducing costs due to the reduction in silver powder content.http://www.sciencedirect.com/science/article/pii/S0142941824003349Conductive adhesive filmEpoxySilver powderElectricalThermal conductivity properties |
| spellingShingle | Hongming Yang Li Zhang Rong Chen Shaoyun Guo Microstructure regulation and fabrication of epoxy-based conductive films with excellent electrical and thermal conductivity, adhesion, toughness, and flexibility Polymer Testing Conductive adhesive film Epoxy Silver powder Electrical Thermal conductivity properties |
| title | Microstructure regulation and fabrication of epoxy-based conductive films with excellent electrical and thermal conductivity, adhesion, toughness, and flexibility |
| title_full | Microstructure regulation and fabrication of epoxy-based conductive films with excellent electrical and thermal conductivity, adhesion, toughness, and flexibility |
| title_fullStr | Microstructure regulation and fabrication of epoxy-based conductive films with excellent electrical and thermal conductivity, adhesion, toughness, and flexibility |
| title_full_unstemmed | Microstructure regulation and fabrication of epoxy-based conductive films with excellent electrical and thermal conductivity, adhesion, toughness, and flexibility |
| title_short | Microstructure regulation and fabrication of epoxy-based conductive films with excellent electrical and thermal conductivity, adhesion, toughness, and flexibility |
| title_sort | microstructure regulation and fabrication of epoxy based conductive films with excellent electrical and thermal conductivity adhesion toughness and flexibility |
| topic | Conductive adhesive film Epoxy Silver powder Electrical Thermal conductivity properties |
| url | http://www.sciencedirect.com/science/article/pii/S0142941824003349 |
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