Microstructure regulation and fabrication of epoxy-based conductive films with excellent electrical and thermal conductivity, adhesion, toughness, and flexibility
The electrically conductive adhesive films (ECAFs) are new materials used for large-format bonding in microelectronics packaging. However, improving its electrical and thermal conductivity, adhesion, and flexibility simultaneously has been a challenge. In this study, silver powder with different par...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-01-01
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| Series: | Polymer Testing |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0142941824003349 |
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| Summary: | The electrically conductive adhesive films (ECAFs) are new materials used for large-format bonding in microelectronics packaging. However, improving its electrical and thermal conductivity, adhesion, and flexibility simultaneously has been a challenge. In this study, silver powder with different particle sizes and poly(3,4-ethylenedioxythiophene)/poly(styrene sulfonate) (PEDOT/PSS) were used to create a high-efficient multi-scale conductive bridge structure. This reduced the volume resistivity from 7.30 × 10−4 Ω cm to 3.80 × 10−4 Ω cm, with lower silver powder content. The thermal conductivity improved from 9.074 W/m·K to 9.124 W/m·K, and adhesion performance between the epoxy matrix and the metal increased from 6.85 MPa to 8.08 MPa. Furthermore, the addition of hydroxyl-functionalized polyurethane materials enhanced the toughness without significantly affecting its electrical, thermal, and adhesion properties. This study successfully prepared epoxy-based conductive adhesive films with a combination of electrical conductivity, thermal conductivity, adhesion, and flexibility, while significantly reducing costs due to the reduction in silver powder content. |
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| ISSN: | 1873-2348 |