Development of GUI-Driven AI Deep Learning Platform for Predicting Warpage Behavior of Fan-Out Wafer-Level Packaging

Development of GUI-Driven AI Deep Learning Platform for Predicting Warpage Behavior of Fan-Out Wafer-Level Packaging

This study presents an artificial intelligence (AI) prediction platform driven by deep learning technologies, designed specifically to address the challenges associated with predicting warpage behavior in fan-out wafer-level packaging (FOWLP). Traditional electronic engineers often face difficulties...

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Bibliographic Details
Main Authors: Ching-Feng Yu, Jr-Wei Peng, Chih-Cheng Hsiao, Chin-Hung Wang, Wei-Chung Lo
Format: Article
Language:English
Published: MDPI AG 2025-03-01
Series:Micromachines
Subjects:
AI prediction platform
fan-out wafer-level packaging (FOWLP)
warpage prediction
graphical user interface (GUI)
deep learning
finite element analysis (FEA)
Online Access:https://www.mdpi.com/2072-666X/16/3/342
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