Application research on the time–frequency analysis method in the quality detection of ultrasonic wire bonding
Imperfection in a bonding point can affect the quality of an entire integrated circuit. Therefore, a time–frequency analysis method was proposed to detect and identify fault bonds. First, the bonding voltage and current signals were acquired from the ultrasonic generator. Second, with Wigner–Ville d...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2021-05-01
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| Series: | International Journal of Distributed Sensor Networks |
| Online Access: | https://doi.org/10.1177/15501477211018346 |
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