Influence of initial surface roughness on the deposition and adhesion of electroless Ni-P plating on 6H-SiC substrate
The aim of this study is to examine the effect of substrate surface roughness on the deposition and adhesion properties of electroless Nickel-Phosphorus (Ni-P) plating on 6H-SiC substrates, which is a typical mold material for Precision Glass Molding (PGM). This research investigated the impact of s...
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Elsevier
2025-03-01
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| Series: | Results in Engineering |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123024021340 |
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| author | Hossein Ahmadian Tianfeng Zhou Weijia Guo Qian Yu A.M. Sadoun A. Fathy Yang Xuanzhe M. Elmahdy |
| author_facet | Hossein Ahmadian Tianfeng Zhou Weijia Guo Qian Yu A.M. Sadoun A. Fathy Yang Xuanzhe M. Elmahdy |
| author_sort | Hossein Ahmadian |
| collection | DOAJ |
| description | The aim of this study is to examine the effect of substrate surface roughness on the deposition and adhesion properties of electroless Nickel-Phosphorus (Ni-P) plating on 6H-SiC substrates, which is a typical mold material for Precision Glass Molding (PGM). This research investigated the impact of surface roughness at different levels. These levels range from polished surfaces with Ra∼58 nm to non-polished surfaces with Ra∼813 nm, affecting both the electroless Ni-P plating process and the quality of the resulting layers. The study reveals that the initial roughness of the substrate significantly influences the final surface profile of electroless Ni-P plating. This is evidenced by the highest roughness of approximately Ra∼1.32 µm observed on the most uneven substrate. Conversely, substrate characterized by an initial roughness of Ra∼160 nm has a reduced post-plating roughness of Ra∼583 nm and contribute to the smoothness of surface. While the observed surface morphology indicates a decrease in the deposition rates. Additionally, the Rockwell C indentation tests indicate that substrates characterized by lower roughness are susceptible to adhesion difficulties, particularly in the form of peeling at the plating-substrate interface. |
| format | Article |
| id | doaj-art-70fd63262b75463eb3dee88963751e61 |
| institution | Kabale University |
| issn | 2590-1230 |
| language | English |
| publishDate | 2025-03-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Results in Engineering |
| spelling | doaj-art-70fd63262b75463eb3dee88963751e612025-01-09T06:14:30ZengElsevierResults in Engineering2590-12302025-03-0125103891Influence of initial surface roughness on the deposition and adhesion of electroless Ni-P plating on 6H-SiC substrateHossein Ahmadian0Tianfeng Zhou1Weijia Guo2Qian Yu3A.M. Sadoun4A. Fathy5Yang Xuanzhe6M. Elmahdy7Department of Mechanical Engineering, Beijing Institute of Technology, Beijing 300081, ChinaDepartment of Mechanical Engineering, Beijing Institute of Technology, Beijing 300081, ChinaDepartment of Mechanical Engineering, Beijing Institute of Technology, Beijing 300081, China; Corresponding authors.Department of Mechanical Engineering, Beijing Institute of Technology, Beijing 300081, ChinaMechanical Engineering Department, Faculty of Engineering, King Abdulaziz University, P.O. Box 80204, Jeddah, Saudi Arabia; Corresponding authors.Department of Mechanical Design and Production Engineering, Faculty of Engineering, Zagazig University, P.O. Box 44519, EgyptDepartment of Mechanical Engineering, Beijing Institute of Technology, Beijing 300081, ChinaMechanical Department, Higher Technological Institute, Tenth of Ramadan city, EgyptThe aim of this study is to examine the effect of substrate surface roughness on the deposition and adhesion properties of electroless Nickel-Phosphorus (Ni-P) plating on 6H-SiC substrates, which is a typical mold material for Precision Glass Molding (PGM). This research investigated the impact of surface roughness at different levels. These levels range from polished surfaces with Ra∼58 nm to non-polished surfaces with Ra∼813 nm, affecting both the electroless Ni-P plating process and the quality of the resulting layers. The study reveals that the initial roughness of the substrate significantly influences the final surface profile of electroless Ni-P plating. This is evidenced by the highest roughness of approximately Ra∼1.32 µm observed on the most uneven substrate. Conversely, substrate characterized by an initial roughness of Ra∼160 nm has a reduced post-plating roughness of Ra∼583 nm and contribute to the smoothness of surface. While the observed surface morphology indicates a decrease in the deposition rates. Additionally, the Rockwell C indentation tests indicate that substrates characterized by lower roughness are susceptible to adhesion difficulties, particularly in the form of peeling at the plating-substrate interface.http://www.sciencedirect.com/science/article/pii/S2590123024021340Electroless Ni–P plating6H-SiCPrecision glass moldingSurface roughnessAdhesion strength |
| spellingShingle | Hossein Ahmadian Tianfeng Zhou Weijia Guo Qian Yu A.M. Sadoun A. Fathy Yang Xuanzhe M. Elmahdy Influence of initial surface roughness on the deposition and adhesion of electroless Ni-P plating on 6H-SiC substrate Results in Engineering Electroless Ni–P plating 6H-SiC Precision glass molding Surface roughness Adhesion strength |
| title | Influence of initial surface roughness on the deposition and adhesion of electroless Ni-P plating on 6H-SiC substrate |
| title_full | Influence of initial surface roughness on the deposition and adhesion of electroless Ni-P plating on 6H-SiC substrate |
| title_fullStr | Influence of initial surface roughness on the deposition and adhesion of electroless Ni-P plating on 6H-SiC substrate |
| title_full_unstemmed | Influence of initial surface roughness on the deposition and adhesion of electroless Ni-P plating on 6H-SiC substrate |
| title_short | Influence of initial surface roughness on the deposition and adhesion of electroless Ni-P plating on 6H-SiC substrate |
| title_sort | influence of initial surface roughness on the deposition and adhesion of electroless ni p plating on 6h sic substrate |
| topic | Electroless Ni–P plating 6H-SiC Precision glass molding Surface roughness Adhesion strength |
| url | http://www.sciencedirect.com/science/article/pii/S2590123024021340 |
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