Influence of initial surface roughness on the deposition and adhesion of electroless Ni-P plating on 6H-SiC substrate

Influence of initial surface roughness on the deposition and adhesion of electroless Ni-P plating on 6H-SiC substrate

The aim of this study is to examine the effect of substrate surface roughness on the deposition and adhesion properties of electroless Nickel-Phosphorus (Ni-P) plating on 6H-SiC substrates, which is a typical mold material for Precision Glass Molding (PGM). This research investigated the impact of s...

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Bibliographic Details
Main Authors: Hossein Ahmadian, Tianfeng Zhou, Weijia Guo, Qian Yu, A.M. Sadoun, A. Fathy, Yang Xuanzhe, M. Elmahdy
Format: Article
Language:English
Published: Elsevier 2025-03-01
Series:Results in Engineering
Subjects:
Electroless Ni–P plating
6H-SiC
Precision glass molding
Surface roughness
Adhesion strength
Online Access:http://www.sciencedirect.com/science/article/pii/S2590123024021340
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Summary:The aim of this study is to examine the effect of substrate surface roughness on the deposition and adhesion properties of electroless Nickel-Phosphorus (Ni-P) plating on 6H-SiC substrates, which is a typical mold material for Precision Glass Molding (PGM). This research investigated the impact of surface roughness at different levels. These levels range from polished surfaces with Ra∼58 nm to non-polished surfaces with Ra∼813 nm, affecting both the electroless Ni-P plating process and the quality of the resulting layers. The study reveals that the initial roughness of the substrate significantly influences the final surface profile of electroless Ni-P plating. This is evidenced by the highest roughness of approximately Ra∼1.32 µm observed on the most uneven substrate. Conversely, substrate characterized by an initial roughness of Ra∼160 nm has a reduced post-plating roughness of Ra∼583 nm and contribute to the smoothness of surface. While the observed surface morphology indicates a decrease in the deposition rates. Additionally, the Rockwell C indentation tests indicate that substrates characterized by lower roughness are susceptible to adhesion difficulties, particularly in the form of peeling at the plating-substrate interface.
ISSN:2590-1230

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