Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering
In this study, the properties of solder joints were compared after bonding process using different energy sources. Various soldering methods were employed, including reflow, laser, and Intense Pulsed Light (IPL) soldering. When reflow soldering was performed for a relatively long time, coarse solder...
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Elsevier
2024-11-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424025213 |
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| author | Eun-Chae Noh Hyo-Won Lee Jong-Woong Kim Seung-Boo Jung Jeong-Won Yoon |
| author_facet | Eun-Chae Noh Hyo-Won Lee Jong-Woong Kim Seung-Boo Jung Jeong-Won Yoon |
| author_sort | Eun-Chae Noh |
| collection | DOAJ |
| description | In this study, the properties of solder joints were compared after bonding process using different energy sources. Various soldering methods were employed, including reflow, laser, and Intense Pulsed Light (IPL) soldering. When reflow soldering was performed for a relatively long time, coarse solder microstructures and interfacial intermetallic compound (IMC) grains were formed. Laser and IPL soldering, which have rapid heating/cooling times, formed fine solder microstructure and thin interfacial IMCs. Then, it was confirmed that Cu6Sn5 and Cu3Sn IMCs were formed at the SAC305/OSP (organic solderability preservative) interface and (Cu,Ni)6Sn5, Ni–Sn–P, and Ni3P were formed at the SAC305/ENEPIG (electroless nickel electroless palladium immersion gold) interface. An observation of the IMC grain morphology under various soldering conditions revealed that (Cu,Ni)6Sn5 was formed on the ENEPIG substrate, which was polygonal and smaller than on the OSP substrate. The shear strength of the joint increased in the order of reflow, laser, and IPL soldering. Additionally, ductile fractures occurred under all conditions. The IPL soldering joint had a thinner IMC compared to reflow soldering, and moderate interface roughness and bonding area compared to laser soldering. Based on the obtained results, a next-generation IPL soldering method is proposed to improve the properties of Sn-3.0Ag-0.5Cu solder joints. |
| format | Article |
| id | doaj-art-6e1126f716d944d8bc4cb4ff1ff7968d |
| institution | Kabale University |
| issn | 2238-7854 |
| language | English |
| publishDate | 2024-11-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-6e1126f716d944d8bc4cb4ff1ff7968d2024-12-26T08:55:10ZengElsevierJournal of Materials Research and Technology2238-78542024-11-013366226632Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light solderingEun-Chae Noh0Hyo-Won Lee1Jong-Woong Kim2Seung-Boo Jung3Jeong-Won Yoon4Department of Advanced Materials Engineering, Chungbuk National University, 1 Chungdae-ro, Seowon-gu, Cheongju, Chungbuk, 28644, Republic of KoreaDepartment of Advanced Materials Engineering, Chungbuk National University, 1 Chungdae-ro, Seowon-gu, Cheongju, Chungbuk, 28644, Republic of KoreaDepartment of Smart Fab Technology, Sungkyunkwan University, Suwon, Gyeonggi-do, 16419, Republic of KoreaSchool of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do, 16419, Republic of KoreaDepartment of Advanced Materials Engineering, Chungbuk National University, 1 Chungdae-ro, Seowon-gu, Cheongju, Chungbuk, 28644, Republic of Korea; Corresponding author.In this study, the properties of solder joints were compared after bonding process using different energy sources. Various soldering methods were employed, including reflow, laser, and Intense Pulsed Light (IPL) soldering. When reflow soldering was performed for a relatively long time, coarse solder microstructures and interfacial intermetallic compound (IMC) grains were formed. Laser and IPL soldering, which have rapid heating/cooling times, formed fine solder microstructure and thin interfacial IMCs. Then, it was confirmed that Cu6Sn5 and Cu3Sn IMCs were formed at the SAC305/OSP (organic solderability preservative) interface and (Cu,Ni)6Sn5, Ni–Sn–P, and Ni3P were formed at the SAC305/ENEPIG (electroless nickel electroless palladium immersion gold) interface. An observation of the IMC grain morphology under various soldering conditions revealed that (Cu,Ni)6Sn5 was formed on the ENEPIG substrate, which was polygonal and smaller than on the OSP substrate. The shear strength of the joint increased in the order of reflow, laser, and IPL soldering. Additionally, ductile fractures occurred under all conditions. The IPL soldering joint had a thinner IMC compared to reflow soldering, and moderate interface roughness and bonding area compared to laser soldering. Based on the obtained results, a next-generation IPL soldering method is proposed to improve the properties of Sn-3.0Ag-0.5Cu solder joints.http://www.sciencedirect.com/science/article/pii/S2238785424025213Reflow solderingLaser solderingIntense pulsed light (IPL) solderingIntermetallic compoundsShear test |
| spellingShingle | Eun-Chae Noh Hyo-Won Lee Jong-Woong Kim Seung-Boo Jung Jeong-Won Yoon Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering Journal of Materials Research and Technology Reflow soldering Laser soldering Intense pulsed light (IPL) soldering Intermetallic compounds Shear test |
| title | Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering |
| title_full | Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering |
| title_fullStr | Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering |
| title_full_unstemmed | Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering |
| title_short | Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering |
| title_sort | properties of sn 3 0ag 0 5cu solder joints under various soldering conditions reflow vs laser vs intense pulsed light soldering |
| topic | Reflow soldering Laser soldering Intense pulsed light (IPL) soldering Intermetallic compounds Shear test |
| url | http://www.sciencedirect.com/science/article/pii/S2238785424025213 |
| work_keys_str_mv | AT eunchaenoh propertiesofsn30ag05cusolderjointsundervarioussolderingconditionsreflowvslaservsintensepulsedlightsoldering AT hyowonlee propertiesofsn30ag05cusolderjointsundervarioussolderingconditionsreflowvslaservsintensepulsedlightsoldering AT jongwoongkim propertiesofsn30ag05cusolderjointsundervarioussolderingconditionsreflowvslaservsintensepulsedlightsoldering AT seungboojung propertiesofsn30ag05cusolderjointsundervarioussolderingconditionsreflowvslaservsintensepulsedlightsoldering AT jeongwonyoon propertiesofsn30ag05cusolderjointsundervarioussolderingconditionsreflowvslaservsintensepulsedlightsoldering |