APA (7th ed.) Citation

Noh, E., Lee, H., Kim, J., Jung, S., & Yoon, J. Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering. Elsevier.

Chicago Style (17th ed.) Citation

Noh, Eun-Chae, Hyo-Won Lee, Jong-Woong Kim, Seung-Boo Jung, and Jeong-Won Yoon. Properties of Sn-3.0Ag-0.5Cu Solder Joints Under Various Soldering Conditions: Reflow Vs. Laser Vs. Intense Pulsed Light Soldering. Elsevier.

MLA (9th ed.) Citation

Noh, Eun-Chae, et al. Properties of Sn-3.0Ag-0.5Cu Solder Joints Under Various Soldering Conditions: Reflow Vs. Laser Vs. Intense Pulsed Light Soldering. Elsevier.