A Review of the Thermal Phase Change Materials (PCM) and Metal Foams for Electronic Chips Cooling
Heat sinks, a type of heat exchanger used due to the simplicity of fabrication, low cost, and reliable heat dissipation, are widely employed to cool electronic devices. In recent decades, heat dissipation has remained a critical challenge in optimizing the thermal performance of heat sinks. Therefo...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Al-Iraqia University - College of Engineering
2024-12-01
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| Series: | Al-Iraqia Journal for Scientific Engineering Research |
| Subjects: | |
| Online Access: | https://ijser.aliraqia.edu.iq/index.php/ijser/article/view/274 |
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