Theeb, A. H. F., & Hussain, I. Y. A Review of the Thermal Phase Change Materials (PCM) and Metal Foams for Electronic Chips Cooling. Al-Iraqia University - College of Engineering.
Chicago Style (17th ed.) CitationTheeb, Ali Hussein F., and Ihsan Y. Hussain. A Review of the Thermal Phase Change Materials (PCM) and Metal Foams for Electronic Chips Cooling. Al-Iraqia University - College of Engineering.
MLA (9th ed.) CitationTheeb, Ali Hussein F., and Ihsan Y. Hussain. A Review of the Thermal Phase Change Materials (PCM) and Metal Foams for Electronic Chips Cooling. Al-Iraqia University - College of Engineering.
Warning: These citations may not always be 100% accurate.