Tribo-Electrochemical Characterization of Brush-Scrubbed Post-CMP Cleaning: Results for Tartrate-Supported Removal of Residual Oxides from Copper Films
Wafer cleaning after chemical mechanical planarization (CMP) is a critical processing step for copper metallization in integrated circuits. Post-CMP cleaning (PCMPC) commonly combines surface (electro)chemistry with the tribology of brush scrubbing to remove CMP residues from wafer surfaces. While t...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-07-01
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| Series: | Lubricants |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4442/13/7/301 |
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