Tribo-Electrochemical Characterization of Brush-Scrubbed Post-CMP Cleaning: Results for Tartrate-Supported Removal of Residual Oxides from Copper Films

Tribo-Electrochemical Characterization of Brush-Scrubbed Post-CMP Cleaning: Results for Tartrate-Supported Removal of Residual Oxides from Copper Films

Wafer cleaning after chemical mechanical planarization (CMP) is a critical processing step for copper metallization in integrated circuits. Post-CMP cleaning (PCMPC) commonly combines surface (electro)chemistry with the tribology of brush scrubbing to remove CMP residues from wafer surfaces. While t...

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Bibliographic Details
Main Authors: Collin M. Reff, Kassapa U. Gamagedara, David R. Santefort, Dipankar Roy
Format: Article
Language:English
Published: MDPI AG 2025-07-01
Series:Lubricants
Subjects:
CMP residues
post CMP cleaning
tribo-electrochemistry
PVA brush
tartaric acid
copper oxides
Online Access:https://www.mdpi.com/2075-4442/13/7/301
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