Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards

Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards

This study presents the development of a modified polyimide (MPI) with low dielectric properties and low-temperature curing capability for high-frequency flexible printed circuit boards (FPCBs). MPI was cured using dicumyl peroxide (DCP) at 80–140 °C through a radical process optimized via DSC analy...

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Bibliographic Details
Main Authors: Seonwoo Kim, Suin Chae, Mirae Seo, Yubin Kim, Soobin Park, Sehoon Park, Hyunjin Nam
Format: Article
Language:English
Published: MDPI AG 2025-05-01
Series:Micro
Subjects:
low-dielectric polyimide
FPCB
high-frequency electronics
low-temperature curing
Online Access:https://www.mdpi.com/2673-8023/5/2/23
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https://www.mdpi.com/2673-8023/5/2/23

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