Experiment and Analysis of Termination Robustness Design for 1200 V 4H-SiC MOSFET

This study investigates the degradation mechanisms of 1200 V SiC MOSFETs during High-temperature Reverse Bias (HTRB) reliability testing, focusing on breakdown voltage (BV) reduction. Experimental results reveal that trapped charges at the SiC/SiO<sub>2</sub> interface in the termination...

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Main Authors: Mengyuan Yu, Yi Shen, Hongping Ma, Qingchun Zhang
Format: Article
Language:English
Published: MDPI AG 2025-05-01
Series:Nanomaterials
Subjects:
Online Access:https://www.mdpi.com/2079-4991/15/11/805
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author Mengyuan Yu
Yi Shen
Hongping Ma
Qingchun Zhang
author_facet Mengyuan Yu
Yi Shen
Hongping Ma
Qingchun Zhang
author_sort Mengyuan Yu
collection DOAJ
description This study investigates the degradation mechanisms of 1200 V SiC MOSFETs during High-temperature Reverse Bias (HTRB) reliability testing, focusing on breakdown voltage (BV) reduction. Experimental results reveal that trapped charges at the SiC/SiO<sub>2</sub> interface in the termination region alter electric field distribution, leading to premature breakdown. To address this issue, an optimized termination structure is proposed, incorporating reduced spacing between adjacent field rings and additional outer rings. TCAD simulations and experimental validation demonstrate that the improved design stabilizes BV within 2% deviation during 1000 h HTRB testing, which significantly enhances termination robustness.
format Article
id doaj-art-58c2d88a6b4546f1b995d2511b275b49
institution DOAJ
issn 2079-4991
language English
publishDate 2025-05-01
publisher MDPI AG
record_format Article
series Nanomaterials
spelling doaj-art-58c2d88a6b4546f1b995d2511b275b492025-08-20T03:11:22ZengMDPI AGNanomaterials2079-49912025-05-01151180510.3390/nano15110805Experiment and Analysis of Termination Robustness Design for 1200 V 4H-SiC MOSFETMengyuan Yu0Yi Shen1Hongping Ma2Qingchun Zhang3Institute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, ChinaInstitute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, ChinaInstitute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, ChinaInstitute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, ChinaThis study investigates the degradation mechanisms of 1200 V SiC MOSFETs during High-temperature Reverse Bias (HTRB) reliability testing, focusing on breakdown voltage (BV) reduction. Experimental results reveal that trapped charges at the SiC/SiO<sub>2</sub> interface in the termination region alter electric field distribution, leading to premature breakdown. To address this issue, an optimized termination structure is proposed, incorporating reduced spacing between adjacent field rings and additional outer rings. TCAD simulations and experimental validation demonstrate that the improved design stabilizes BV within 2% deviation during 1000 h HTRB testing, which significantly enhances termination robustness.https://www.mdpi.com/2079-4991/15/11/805SiC MOSFETterminationbreakdown voltage
spellingShingle Mengyuan Yu
Yi Shen
Hongping Ma
Qingchun Zhang
Experiment and Analysis of Termination Robustness Design for 1200 V 4H-SiC MOSFET
Nanomaterials
SiC MOSFET
termination
breakdown voltage
title Experiment and Analysis of Termination Robustness Design for 1200 V 4H-SiC MOSFET
title_full Experiment and Analysis of Termination Robustness Design for 1200 V 4H-SiC MOSFET
title_fullStr Experiment and Analysis of Termination Robustness Design for 1200 V 4H-SiC MOSFET
title_full_unstemmed Experiment and Analysis of Termination Robustness Design for 1200 V 4H-SiC MOSFET
title_short Experiment and Analysis of Termination Robustness Design for 1200 V 4H-SiC MOSFET
title_sort experiment and analysis of termination robustness design for 1200 v 4h sic mosfet
topic SiC MOSFET
termination
breakdown voltage
url https://www.mdpi.com/2079-4991/15/11/805
work_keys_str_mv AT mengyuanyu experimentandanalysisofterminationrobustnessdesignfor1200v4hsicmosfet
AT yishen experimentandanalysisofterminationrobustnessdesignfor1200v4hsicmosfet
AT hongpingma experimentandanalysisofterminationrobustnessdesignfor1200v4hsicmosfet
AT qingchunzhang experimentandanalysisofterminationrobustnessdesignfor1200v4hsicmosfet