Automated Thermal Optimization of Pinfin Heatsinks for Three-Phase Multichip SiC Power Modules
With the growing demands for compact and high-efficiency electric vehicle (EV) drive systems, effective thermal management of Silicon Carbide (SiC) power modules has become a critical design challenge. This paper proposes an optimization methodology for Pinfin heatsinks, aiming to effectively reduce...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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IEEE
2025-01-01
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| Series: | IEEE Open Journal of Power Electronics |
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| Online Access: | https://ieeexplore.ieee.org/document/11091420/ |
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| _version_ | 1849247591562215424 |
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| author | Xiaoshuang Hui Puqi Ning Tao Fan Yuhui Kang Zhiqiang Wang |
| author_facet | Xiaoshuang Hui Puqi Ning Tao Fan Yuhui Kang Zhiqiang Wang |
| author_sort | Xiaoshuang Hui |
| collection | DOAJ |
| description | With the growing demands for compact and high-efficiency electric vehicle (EV) drive systems, effective thermal management of Silicon Carbide (SiC) power modules has become a critical design challenge. This paper proposes an optimization methodology for Pinfin heatsinks, aiming to effectively reduce the maximum junction temperature and improve thermal uniformity among parallel-connected chips in three-phase multichip SiC power modules. Through analysis of the thermal model, a parametric automated optimization framework for circularly regular Pinfin heatsinks was established, utilizing the Lattice Boltzmann Method (LBM) for efficient thermal performance evaluation. Based on the proposed automated optimization approach, optimizations for reducing thermal redundancy chips and minimizing temperature difference were respectively carried out for designed three-phase SiC power module. Furthermore, a novel irregular layout of elliptical Pinfin with randomized orientations and aspect ratios is proposed and optimized. Experimental validation and simulation results demonstrated the effectiveness of the proposed method. |
| format | Article |
| id | doaj-art-519a8fb6703d4ad891bcfb1e7daa84b4 |
| institution | Kabale University |
| issn | 2644-1314 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Open Journal of Power Electronics |
| spelling | doaj-art-519a8fb6703d4ad891bcfb1e7daa84b42025-08-20T03:58:10ZengIEEEIEEE Open Journal of Power Electronics2644-13142025-01-0161323133210.1109/OJPEL.2025.359190811091420Automated Thermal Optimization of Pinfin Heatsinks for Three-Phase Multichip SiC Power ModulesXiaoshuang Hui0https://orcid.org/0009-0005-3918-9896Puqi Ning1https://orcid.org/0000-0002-8621-8435Tao Fan2https://orcid.org/0000-0001-9193-2855Yuhui Kang3Zhiqiang Wang4https://orcid.org/0000-0001-5946-8407Key Laboratory of High Density Electromagnetic Power and Systems(Chinese Academy of Sciences), Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing, ChinaKey Laboratory of High Density Electromagnetic Power and Systems(Chinese Academy of Sciences), Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing, ChinaKey Laboratory of High Density Electromagnetic Power and Systems(Chinese Academy of Sciences), Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing, ChinaKey Laboratory of High Density Electromagnetic Power and Systems(Chinese Academy of Sciences), Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing, ChinaSchool of Electrical and Electronic Engineering, Huazhong University of Sciences and Technology, Wuhan, ChinaWith the growing demands for compact and high-efficiency electric vehicle (EV) drive systems, effective thermal management of Silicon Carbide (SiC) power modules has become a critical design challenge. This paper proposes an optimization methodology for Pinfin heatsinks, aiming to effectively reduce the maximum junction temperature and improve thermal uniformity among parallel-connected chips in three-phase multichip SiC power modules. Through analysis of the thermal model, a parametric automated optimization framework for circularly regular Pinfin heatsinks was established, utilizing the Lattice Boltzmann Method (LBM) for efficient thermal performance evaluation. Based on the proposed automated optimization approach, optimizations for reducing thermal redundancy chips and minimizing temperature difference were respectively carried out for designed three-phase SiC power module. Furthermore, a novel irregular layout of elliptical Pinfin with randomized orientations and aspect ratios is proposed and optimized. Experimental validation and simulation results demonstrated the effectiveness of the proposed method.https://ieeexplore.ieee.org/document/11091420/SiC power modulespinfin heatsinkthermal modeloptimizationjunction temperature |
| spellingShingle | Xiaoshuang Hui Puqi Ning Tao Fan Yuhui Kang Zhiqiang Wang Automated Thermal Optimization of Pinfin Heatsinks for Three-Phase Multichip SiC Power Modules IEEE Open Journal of Power Electronics SiC power modules pinfin heatsink thermal model optimization junction temperature |
| title | Automated Thermal Optimization of Pinfin Heatsinks for Three-Phase Multichip SiC Power Modules |
| title_full | Automated Thermal Optimization of Pinfin Heatsinks for Three-Phase Multichip SiC Power Modules |
| title_fullStr | Automated Thermal Optimization of Pinfin Heatsinks for Three-Phase Multichip SiC Power Modules |
| title_full_unstemmed | Automated Thermal Optimization of Pinfin Heatsinks for Three-Phase Multichip SiC Power Modules |
| title_short | Automated Thermal Optimization of Pinfin Heatsinks for Three-Phase Multichip SiC Power Modules |
| title_sort | automated thermal optimization of pinfin heatsinks for three phase multichip sic power modules |
| topic | SiC power modules pinfin heatsink thermal model optimization junction temperature |
| url | https://ieeexplore.ieee.org/document/11091420/ |
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