A Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions

A Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions

Glass substrate, a new type of substrate with excellent mechanical and electrical properties of glass itself, has great potential to become an ideal platform for heterogeneous integration in chiplet systems for high-performance computing applications. The residual stress of the metal layer generated...

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Bibliographic Details
Main Authors: Gangli Yang, Tailong Shi, Liu Chang, Hongjia Zhu, Dongyu Tong, Wending Yang, Zeyuan Li, Liyi Li
Format: Article
Language:English
Published: MDPI AG 2024-11-01
Series:Micromachines
Subjects:
residual stress
nanotwinned Cu
glass substrate
EBSD
Online Access:https://www.mdpi.com/2072-666X/15/11/1370
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