APA (7th ed.) Citation

Yang, G., Shi, T., Chang, L., Zhu, H., Tong, D., Yang, W., . . . Li, L. A Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions. MDPI AG.

Chicago Style (17th ed.) Citation

Yang, Gangli, Tailong Shi, Liu Chang, Hongjia Zhu, Dongyu Tong, Wending Yang, Zeyuan Li, and Liyi Li. A Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions. MDPI AG.

MLA (9th ed.) Citation

Yang, Gangli, et al. A Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions. MDPI AG.