Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem
With the development of electronical technology and the construction of the fifth-generation cellular networks, electronic devices with higher integrated level and power are widely applied. Hence, greater demands are being placed on electronic packaging materials. High-Pb solder alloys were widely u...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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Wiley
2020-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2020/4969647 |
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| _version_ | 1841524451530768384 |
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| author | Jiachen Xu Mingfang Wu Juan Pu Songbai Xue |
| author_facet | Jiachen Xu Mingfang Wu Juan Pu Songbai Xue |
| author_sort | Jiachen Xu |
| collection | DOAJ |
| description | With the development of electronical technology and the construction of the fifth-generation cellular networks, electronic devices with higher integrated level and power are widely applied. Hence, greater demands are being placed on electronic packaging materials. High-Pb solder alloys were widely used for low- and medium-temperature soldering for the past decades but have been prohibited due to toxicity. Au-based solder alloys with proper melting and mechanical properties show great potential to replace high-Pb solder alloys and are being emphasized recently. But in comparison with Pb-containing solder alloys, the investigation on novel Au-based solder alloys is quite insufficient, and their performance and reliability are still unclear. In this paper, the recent research studies on Au-based solder alloys with low temperature and medium temperature were reviewed and their microstructure, mechanical performance, and reliability were introduced and analyzed. Moreover, the novel processing technologies of Au-based solder alloys were discussed and compared. |
| format | Article |
| id | doaj-art-4723e36d3ae249039050e07d7161b909 |
| institution | Kabale University |
| issn | 1687-8434 1687-8442 |
| language | English |
| publishDate | 2020-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Advances in Materials Science and Engineering |
| spelling | doaj-art-4723e36d3ae249039050e07d7161b9092025-02-03T05:53:09ZengWileyAdvances in Materials Science and Engineering1687-84341687-84422020-01-01202010.1155/2020/49696474969647Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging ProblemJiachen Xu0Mingfang Wu1Juan Pu2Songbai Xue3Jiangsu Provincial Key Laboratory of Advanced Welding Technology, Jiangsu University of Science and Technology, Zhenjiang 212003, ChinaJiangsu Provincial Key Laboratory of Advanced Welding Technology, Jiangsu University of Science and Technology, Zhenjiang 212003, ChinaJiangsu Provincial Key Laboratory of Advanced Welding Technology, Jiangsu University of Science and Technology, Zhenjiang 212003, ChinaCollege of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, ChinaWith the development of electronical technology and the construction of the fifth-generation cellular networks, electronic devices with higher integrated level and power are widely applied. Hence, greater demands are being placed on electronic packaging materials. High-Pb solder alloys were widely used for low- and medium-temperature soldering for the past decades but have been prohibited due to toxicity. Au-based solder alloys with proper melting and mechanical properties show great potential to replace high-Pb solder alloys and are being emphasized recently. But in comparison with Pb-containing solder alloys, the investigation on novel Au-based solder alloys is quite insufficient, and their performance and reliability are still unclear. In this paper, the recent research studies on Au-based solder alloys with low temperature and medium temperature were reviewed and their microstructure, mechanical performance, and reliability were introduced and analyzed. Moreover, the novel processing technologies of Au-based solder alloys were discussed and compared.http://dx.doi.org/10.1155/2020/4969647 |
| spellingShingle | Jiachen Xu Mingfang Wu Juan Pu Songbai Xue Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem Advances in Materials Science and Engineering |
| title | Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem |
| title_full | Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem |
| title_fullStr | Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem |
| title_full_unstemmed | Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem |
| title_short | Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem |
| title_sort | novel au based solder alloys a potential answer for electrical packaging problem |
| url | http://dx.doi.org/10.1155/2020/4969647 |
| work_keys_str_mv | AT jiachenxu novelaubasedsolderalloysapotentialanswerforelectricalpackagingproblem AT mingfangwu novelaubasedsolderalloysapotentialanswerforelectricalpackagingproblem AT juanpu novelaubasedsolderalloysapotentialanswerforelectricalpackagingproblem AT songbaixue novelaubasedsolderalloysapotentialanswerforelectricalpackagingproblem |