APA (7th ed.) Citation

Xu, J., Wu, M., Pu, J., & Xue, S. Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem. Wiley.

Chicago Style (17th ed.) Citation

Xu, Jiachen, Mingfang Wu, Juan Pu, and Songbai Xue. Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem. Wiley.

MLA (9th ed.) Citation

Xu, Jiachen, et al. Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem. Wiley.