Microstructure evolution and mechanical properties of diffusion bonding CoCrCuFeNi high entropy alloy to Inconel 600 alloy

Microstructure evolution and mechanical properties of diffusion bonding CoCrCuFeNi high entropy alloy to Inconel 600 alloy

In this study, the CoCrCuFeNi high entropy alloy was diffusion bonded with the Inconel 600 superalloy at bonding temperatures ranging from 950 to 1100 °C for a bonding time of 2 h under a pressure of 20 MPa in a vacuum. The microstructure and mechanical properties of the diffusion bonded joints were...

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Bibliographic Details
Main Authors: Honglong Zhao, Fugui Zhou, Xuefeng Shen, Juan Li, Qingdong Qin, Jianming Wu
Format: Article
Language:English
Published: Elsevier 2024-11-01
Series:Journal of Materials Research and Technology
Subjects:
Diffusion bonding
High entropy alloy
Inconel 600
Microstructure
Mechanical properties
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785424025869
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