Fatigue-Induced Failure of Polysilicon MEMS: Nonlinear Reduced-Order Modeling and Geometry Optimization of On-Chip Testing Device
In the case of repeated loadings, the reliability of inertial microelectromechanical systems (MEMS) can be linked to failure processes occurring within the movable structure or at the anchors. In this work, possible debonding mechanisms taking place at the interface between the polycrystalline silic...
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MDPI AG
2024-12-01
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| author | Daniel Calegaro Massimiliano Merli Giacomo Ferrari Stefano Mariani |
| author_facet | Daniel Calegaro Massimiliano Merli Giacomo Ferrari Stefano Mariani |
| author_sort | Daniel Calegaro |
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| description | In the case of repeated loadings, the reliability of inertial microelectromechanical systems (MEMS) can be linked to failure processes occurring within the movable structure or at the anchors. In this work, possible debonding mechanisms taking place at the interface between the polycrystalline silicon film constituting the movable part of the device and the silicon dioxide at the anchor points are considered. In dealing with cyclic loadings possibly inducing fatigue failure, a strategy is proposed to optimize the geometry of an on-chip testing device designed to characterize the strength of the aforementioned interface. Dynamic analyses are carried out to assess the deformation mode of the device and maximize the stress field leading to interface debonding. To cope with the computational costs of numerical simulations within the structural optimization framework, a reduced-order modeling procedure for nonlinear systems is discussed, based on the direct parametrization of invariant manifolds (DPIM). The results are reported in terms of maximum stress intensification for varying geometry of the testing device and actuation frequency to demonstrate the accuracy and computational efficiency of the proposed methodology. |
| format | Article |
| id | doaj-art-455d12de8a194144baa6c334e6216e53 |
| institution | Kabale University |
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| language | English |
| publishDate | 2024-12-01 |
| publisher | MDPI AG |
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| series | Micromachines |
| spelling | doaj-art-455d12de8a194144baa6c334e6216e532024-12-27T14:40:48ZengMDPI AGMicromachines2072-666X2024-12-011512148010.3390/mi15121480Fatigue-Induced Failure of Polysilicon MEMS: Nonlinear Reduced-Order Modeling and Geometry Optimization of On-Chip Testing DeviceDaniel Calegaro0Massimiliano Merli1Giacomo Ferrari2Stefano Mariani3Department of Civil and Environmental Engineering, Politecnico di Milano, Piazza Leonardo da Vinci, 32, 20133 Milano, ItalySTMicroelectronics, 20007 Cornaredo, ItalySTMicroelectronics, 20007 Cornaredo, ItalyDepartment of Civil and Environmental Engineering, Politecnico di Milano, Piazza Leonardo da Vinci, 32, 20133 Milano, ItalyIn the case of repeated loadings, the reliability of inertial microelectromechanical systems (MEMS) can be linked to failure processes occurring within the movable structure or at the anchors. In this work, possible debonding mechanisms taking place at the interface between the polycrystalline silicon film constituting the movable part of the device and the silicon dioxide at the anchor points are considered. In dealing with cyclic loadings possibly inducing fatigue failure, a strategy is proposed to optimize the geometry of an on-chip testing device designed to characterize the strength of the aforementioned interface. Dynamic analyses are carried out to assess the deformation mode of the device and maximize the stress field leading to interface debonding. To cope with the computational costs of numerical simulations within the structural optimization framework, a reduced-order modeling procedure for nonlinear systems is discussed, based on the direct parametrization of invariant manifolds (DPIM). The results are reported in terms of maximum stress intensification for varying geometry of the testing device and actuation frequency to demonstrate the accuracy and computational efficiency of the proposed methodology.https://www.mdpi.com/2072-666X/15/12/1480polysilicon MEMSon-chip testingreliabilityfatigue-induced failurereduced-order modelingDPIM |
| spellingShingle | Daniel Calegaro Massimiliano Merli Giacomo Ferrari Stefano Mariani Fatigue-Induced Failure of Polysilicon MEMS: Nonlinear Reduced-Order Modeling and Geometry Optimization of On-Chip Testing Device Micromachines polysilicon MEMS on-chip testing reliability fatigue-induced failure reduced-order modeling DPIM |
| title | Fatigue-Induced Failure of Polysilicon MEMS: Nonlinear Reduced-Order Modeling and Geometry Optimization of On-Chip Testing Device |
| title_full | Fatigue-Induced Failure of Polysilicon MEMS: Nonlinear Reduced-Order Modeling and Geometry Optimization of On-Chip Testing Device |
| title_fullStr | Fatigue-Induced Failure of Polysilicon MEMS: Nonlinear Reduced-Order Modeling and Geometry Optimization of On-Chip Testing Device |
| title_full_unstemmed | Fatigue-Induced Failure of Polysilicon MEMS: Nonlinear Reduced-Order Modeling and Geometry Optimization of On-Chip Testing Device |
| title_short | Fatigue-Induced Failure of Polysilicon MEMS: Nonlinear Reduced-Order Modeling and Geometry Optimization of On-Chip Testing Device |
| title_sort | fatigue induced failure of polysilicon mems nonlinear reduced order modeling and geometry optimization of on chip testing device |
| topic | polysilicon MEMS on-chip testing reliability fatigue-induced failure reduced-order modeling DPIM |
| url | https://www.mdpi.com/2072-666X/15/12/1480 |
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