Thermal Load Influence during the Formation of Al-Al Contacts on the Electrical Parameters of the Integrated Circuits with Aluminum-Polysilicon Contacts

Thermal Load Influence during the Formation of Al-Al Contacts on the Electrical Parameters of the Integrated Circuits with Aluminum-Polysilicon Contacts

This work is devoted to establishing the effect of using rapid thermal processing (RTP) method (450 °C, 7 s) to form an ohmic contact between two layers of aluminum metallization on the electrical parameters and reliability of integrated circuits. The resistance values of contact chains aluminum-sil...

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Bibliographic Details
Main Authors: V. A. Pilipenko, V. A. Solodukha, N. S. Kovalchuk, J. A. Solovjov, D. V. Shestovski, D. V. Zhyhulin
Format: Article
Language:Russian
Published: Educational institution «Belarusian State University of Informatics and Radioelectronics» 2022-12-01
Series:Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki
Subjects:
rapid thermal processing method
ohmic contact
thermal load
i-v characteristics
Online Access:https://doklady.bsuir.by/jour/article/view/3496
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