High-efficiency SOI-based metalenses at telecommunication wavelengths
We demonstrated silicon-on-insulator (SOI)-based high-efficiency metalenses at telecommunication wavelengths that are integrable with a standard 220 nm-thick silicon photonic chip. A negative electron-beam resist (ma-N) was placed on top of the Si nanodisk, providing vertical symmetry to realize hig...
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Main Authors: | Ryu Taesu, Kim Moohyuk, Hwang Yongsop, Kim Myung-Ki, Yang Jin-Kyu |
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Format: | Article |
Language: | English |
Published: |
De Gruyter
2022-10-01
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Series: | Nanophotonics |
Subjects: | |
Online Access: | https://doi.org/10.1515/nanoph-2022-0480 |
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