A Chisel Generator for Standardized 3-D Die-to-Die Interconnects
A 3-D heterogeneous integration (3-D-HI) is poised to enable a new era of high-performance integrated circuits via a multitude of benefits, including a reduction in I/O power consumption and ability to tightly couple disparate technologies. However, a significant hurdle toward enabling a chiplet eco...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2024-01-01
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| Series: | IEEE Journal on Exploratory Solid-State Computational Devices and Circuits |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10681023/ |
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