High-Performance Cu<sub>1.8</sub>Se Nanosheets for Dual-Sensing: H<sub>2</sub>O<sub>2</sub> Electrochemical Detection and SERS Substrate
A facile fabrication method was developed for the growth of Cu<sub>1.8</sub>Se nanosheets (NSs) on a Cu foil substrate, enabling dual-functionality as an electrochemical sensor for H<sub>2</sub>O<sub>2</sub> and an active surface-enhanced Raman scattering (SERS) s...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-06-01
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| Series: | Nanomaterials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-4991/15/13/998 |
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| Summary: | A facile fabrication method was developed for the growth of Cu<sub>1.8</sub>Se nanosheets (NSs) on a Cu foil substrate, enabling dual-functionality as an electrochemical sensor for H<sub>2</sub>O<sub>2</sub> and an active surface-enhanced Raman scattering (SERS) substrate. The process involved the preparation of Cu(OH)<sub>2</sub> nanowires (NWs) via electrochemical oxidation, followed by chemical conversion to Cu<sub>1.8</sub>Se through a selenization process. The morphology, composition, and microstructure of the resulting Cu<sub>1.8</sub>Se NSs were systematically characterized using scanning electron microscopy (SEM), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS). The Cu<sub>1.8</sub>Se NSs exhibited excellent electrocatalytic activity for H<sub>2</sub>O<sub>2</sub> reduction, achieving a notably low detection limit of 1.25 μM and demonstrating rapid response and high sensitivity with a linear relationship in amperometric detection. Additionally, SERS experiments using Rhodamine B as a probe molecule and the Cu<sub>1.8</sub>Se NS/Cu foil as a substrate displayed outstanding performance, with a detection limit as low as 1 μM. The flower-like structure of the Cu<sub>1.8</sub>Se NSs exhibited linear dependence between analyte concentration and detection signals, along with satisfactory reproducibility in dual-sensing applications. These findings underscore the scalability and potential of this fabrication approach for advanced sensor development. |
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| ISSN: | 2079-4991 |