APA (7th ed.) Citation

Dongye, Z., Zhang, W., Qi, L., Gu, B., Shen, H., Zhang, X., & Cui, X. Real‐time reliability evaluation method for IGBT module in MMC based on junction temperature and bond wire failure online monitoring. Wiley.

Chicago Style (17th ed.) Citation

Dongye, Zhonghao, Wuyu Zhang, Lei Qi, Bowen Gu, Hong Shen, Xiangyu Zhang, and Xiang Cui. Real‐time Reliability Evaluation Method for IGBT Module in MMC Based on Junction Temperature and Bond Wire Failure Online Monitoring. Wiley.

MLA (9th ed.) Citation

Dongye, Zhonghao, et al. Real‐time Reliability Evaluation Method for IGBT Module in MMC Based on Junction Temperature and Bond Wire Failure Online Monitoring. Wiley.